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Substrate loader

A technology for loading and unloading machines and substrates, applied in the directions of transportation and packaging, conveyor objects, etc., can solve problems such as low efficiency, brittle substrate materials, and poor substrates, and achieve the effect of improving efficiency and reducing bad results.

Active Publication Date: 2021-09-07
HUNAN KAITONG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At this stage, since there are fine circuits, ICs, soldering gold wires, resins, etc. on the substrate, these require dust-free and no hand contact. Therefore, when manually placing the substrate on the substrate shuttle, it is extremely easy to touch the surface of the substrate Cause defects, while the material of the substrate itself is relatively brittle and easy to break. When people work manually, they must be very careful and slow, resulting in low efficiency. Existing, such as Korean Patent No.
Published) discloses a wafer conveyor used to transport wafers in cassettes. Although the wafer conveyor disclosed in the patent document can reduce the defects caused by manual loading and unloading of wafers, it can only transport a group of wafers in the handling process. ,low efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The present invention provides such Figure 1-5 The substrate loading and unloading machine shown includes a counterweight base 1, a support base 2, a lifting device 3, an adjustment device 4 and a limit device 5, and the two sides of the top of the counterweight base 1 are respectively provided with a support base 2 and a lifting device 3 , the bottom of the support base 2 is connected to the top of the counterweight base 1 by bolts, the top of the support base 2 is provided with a support groove with a U-shaped cross-section, and an adaptive adjustment device 4 is provided in the support groove. The side of the adjustment device 4 away from the support groove is adapted to the inner circumference of the lifting device 3, and both sides of the top of the support seat 2 close to the lifting device 3 are provided with a limit device 5, and between the tops of the two groups of limit devices 5 There are five sets of substrate bodies 6 equidistantly distributed, and the su...

Embodiment 2

[0026] On the basis of Embodiment 1, the lifting device 3 includes a lifting platform 7, a substrate shuttle 8 and a connecting rod 9, and the lifting platform 7 can be selected as the MVSC13 precision electronically controlled lifting platform produced by Wuhan Huatian Keyuan Optoelectronics Co., Ltd. The lifting platform 7 is electrically connected to the external driving power supply, the bottom of the lifting platform 7 is connected to the top of the counterweight base 1 through bolts, and both sides of the lifting part of the lifting platform 7 are equipped with substrate shuttles 8 through bolts, The inner side and the outer side of the middle part of the substrate shuttle 8 are all dug with fifteen sets of storage slots distributed equidistantly. The cross section of the storage slots is U-shaped. Connecting rod 9, both ends of the connecting rod 9 are connected to the substrate shuttle 8 by bolts, when the adjusting plate 11 arrives in the substrate shuttle 8 with the s...

Embodiment 3

[0028] On the basis of Embodiment 1, the adjusting device 4 includes a sliding seat 10, an adjusting plate 11 and a slider 12. U-shaped adjustment plate 11, the bottom of the adjustment plate 11 is equipped with a slide block 12 by bolts, the slide groove provided at the bottom of the slide block 12 is compatible with the slide seat 10, and the slide block 12 is connected with the slide through the slide groove. The seat 10 is slidably connected, and the top of the adjustment plate 11 is drilled with six sets of adjustment holes. The distance between the two adjacent adjustment holes is adapted to the width of the base plate, and the push handle 17 is pushed, and the sliding block 12 and the sliding seat are connected. 10 is slidingly connected to drive the adjustment plate 11 to move towards the substrate shuttle 8.

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PUM

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Abstract

The invention discloses a substrate loading and unloading machine, which comprises a counterweight base, a support base, a lifting device, an adjustment device and a limit device. The two sides of the top of the counterweight base are respectively provided with a support base and a lifting device. The top of the support base is A support groove with a U-shaped cross-section is provided, and an adaptive adjustment device is provided in the support groove. The side of the adjustment device away from the support groove is adapted to the inner circumference of the lifting device, and the top of the support seat is close to both sides of the lifting device. Both are equipped with a limit device, and five sets of substrate bodies are equidistantly distributed between the tops of the two groups of limit devices. A drive plate is installed through bolts, and the changeover switch of the lifting platform of the lifting device is installed on the drive plate. The substrate loading and unloading machine can improve the efficiency of the substrate loading and unloading shuttle, and at the same time reduce defects caused by manual work.

Description

technical field [0001] The invention belongs to the technical field of substrates, and in particular relates to a substrate loading and unloading machine. Background technique [0002] The substrate is the basic material for the manufacture of printed circuit boards (PCBs). In general, the substrate is a copper-clad laminate. In the manufacture of single-sided and double-sided printed boards, it is selected on the substrate material-copper-clad laminate. Carry out processing such as hole processing, chemical copper plating, electroplating copper, etching, etc., to obtain the required circuit pattern. The manufacture of another type of multi-layer printed board is also based on the inner core thin copper clad laminate, and the conductive pattern layer and the prepreg are alternately laminated and bonded together at one time to form the interconnection between the conductive pattern layers of more than 3 layers. . It has three functions of conduction, insulation and support....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/74
CPCB65G47/74
Inventor 王共海刘善政王立华李国春于永辉蔡小辉
Owner HUNAN KAITONG ELECTRONICS CO LTD