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Substrate loading and unloading machine

A loading and unloading machine and substrate technology, applied in the direction of conveyor objects, transportation and packaging, etc., can solve the problems of low efficiency, low efficiency, slowness, etc., and achieve the effect of reducing bad results and improving efficiency

Active Publication Date: 2020-02-21
HUNAN KAITONG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At this stage, since there are fine circuits, ICs, soldering gold wires, resins, etc. on the substrate, these require dust-free and no hand contact. Therefore, when manually placing the substrate on the substrate shuttle, it is extremely easy to touch the surface of the substrate Cause defects, and the material of the substrate itself is relatively brittle and easy to break. When people work manually, they must be very careful and slow, resulting in low efficiency. The existing ones, such as Korean Patent No.
Published) discloses a wafer conveyor used to transport wafers in cassettes. Although the wafer conveyor disclosed in the patent document can reduce the defects caused by manual loading and unloading of wafers, it can only transport one group of wafers in the handling process. ,low efficiency

Method used

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  • Substrate loading and unloading machine
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  • Substrate loading and unloading machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The present invention provides such as Figure 1-5 The substrate loading and unloading machine shown includes a counterweight seat 1, a support seat 2, a lifting device 3, an adjusting device 4 and a limit device 5. The two sides of the top of the counterweight seat 1 are respectively provided with a supporting seat 2 and a lifting device 3 , the bottom of the support base 2 is connected with the top of the counterweight base 1 by bolts, the top of the support base 2 is provided with a support groove with a U-shaped cross-section, and a suitable adjustment device 4 is arranged in the support groove. The side of the adjusting device 4 away from the support groove is adapted to the inner circumference of the lifting device 3 , and the two sides of the top of the support base 2 close to the lifting device 3 are provided with limiting devices 5 , between the tops of the two sets of the limiting devices 5 There are five groups of substrate bodies 6 equidistantly distributed,...

Embodiment 2

[0026] On the basis of Example 1, the lifting device 3 includes a lifting table 7, a substrate shuttle 8 and a connecting rod 9, and the lifting table 7 can be selected as the MVSC13 type precision electronically controlled lifting table produced by Wuhan Huatian Keyuan Optoelectronics Co., Ltd., The lift table 7 is electrically connected to an external driving power source, the bottom of the lift table 7 is connected to the top of the counterweight base 1 through bolts, and the substrate shuttle 8 is installed on both sides of the lift portion of the lift table 7 through bolts. Fifteen groups of equidistant storage slots are dug inside and outside the middle of the substrate shuttle 8. The cross section of the storage slots is U-shaped. The connecting rod 9, both ends of the connecting rod 9 are connected with the substrate shuttle 8 by bolts. When the adjusting plate 11 reaches the substrate shuttle 8 with the substrate body 6, the lifting platform 7 is opened, and the substr...

Embodiment 3

[0028] On the basis of Embodiment 1, the adjusting device 4 includes a sliding seat 10 , an adjusting plate 11 and a sliding block 12 . A U-shaped adjusting plate 11, the bottom of the adjusting plate 11 is mounted with a sliding block 12 through bolts, the sliding groove opened at the bottom of the sliding block 12 is adapted to the sliding seat 10, and the sliding block 12 is connected to the sliding block 12 through the sliding groove. The seat 10 is slidably connected, the top of the adjustment plate 11 is drilled with six groups of adjustment holes, and the distance between the two adjacent adjustment holes is adapted to the width of the base plate. 10 is slidably connected to drive the adjusting plate 11 to move toward the substrate shuttle 8 .

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PUM

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Abstract

The invention discloses a substrate loading and unloading machine comprising a counter weight seat, a supporting seat, a lifting device, an adjusting device and a limiting device. The two sides of thetop of the counter weight seat are provided with the supporting seat and the lifting device correspondingly. The top of the supporting seat is provided with a supporting groove with a U-shaped section. The adaptive adjusting device is arranged in the supporting groove. The side, far away from the supporting groove, of the adjusting piece is adapted to the inner circumference of the lifting device. The two sides, close to the lifting device, of the top of the supporting seat are both provided with limiting devices. Five groups of substrate bodies which are evenly distributed are arranged between the tops of the two limiting devices. The substrate bodies are adapted to the inner circumference of the lifting device. The side, far away from support, of the supporting seat is provided with a drive plate through bolts. The drive plate is provided with an alternation switch of a lifting platform of the lifting device. The substrate loading and unloading machine can improve the substrate shuttle loading and unloading efficiency and can lower poor quality caused by manual operation.

Description

technical field [0001] The invention belongs to the technical field of substrates, and in particular relates to a substrate loading and unloading machine. Background technique [0002] The substrate is the basic material for the manufacture of printed circuit boards (PCB). In general, the substrate is a copper-clad laminate. In the manufacture of single-sided and double-sided printed boards, the substrate material-copper-clad laminate is selected. Carry out processing such as hole processing, electroless copper plating, copper electroplating, etching, etc. to obtain the desired circuit pattern. The manufacture of another type of multilayer printed board is also based on the inner core thin copper clad laminate, and the conductive pattern layer and the prepreg are alternately bonded together by one-time lamination to form more than 3 layers of conductive pattern interlayer interconnection . It has three functions of conduction, insulation and support. [0003] At this stag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/74
CPCB65G47/74
Inventor 王共海刘善政王立华李国春于永辉蔡小辉
Owner HUNAN KAITONG ELECTRONICS CO LTD