A light emitting element, backlight module and display device

Abstract

Embodiments of the present invention provide a light emitting element, a backlight module and a display device, which relate to the field of optoelectronic devices, can reduce the loss of outgoing light caused by full emission, and improve the light extraction efficiency of the light emitting element. The light-emitting element includes: the optical chips are arranged on the substrate in an array; the protective layer covers the light source chips; on the light-emitting surface of the protective layer, grooves are arranged between adjacent light source chips; the opening direction of the grooves faces the protective layer The light emitting direction of the groove; the shape of the groove is such that the groove wall can refract the light emitted by the light source chip onto the groove wall of the groove to the excited light emitting layer; the excited light emitting layer is arranged on the protection On the light emitting surface of the layer, the excited light layer is excited by the light emitted by the light source chip to emit light.

Description

technical field [0001] The invention relates to the field of optoelectronic devices, in particular to a light emitting element, a backlight module and a display device. Background technique [0002] The chip size of Mini-LED (English full name: Mini-Light Emitting Diode) is between 100-200 μm. Mini LED is used in direct-lit design and can be made into local dimming. It will have more advantages than ordinary edge-lit backlight chips. Good uniformity of light transmission, high contrast and more light and shade details; Mini LED backlight TV LEDs have a small spacing and uniform light mixing, which can remove the thick traditional TV backlight film, reduce the light mixing distance, and realize ultra-thin module design , comparable to the thickness of OLED. [0003] LED chips generally need to be packaged and protected to avoid dirt and damage. Such as figure 1 As shown, a typical packaging method is as follows: LED chips 11 are distributed in an array on the substrate 12,...

AI Technical Summary

Problems solved by technology

The transparent coating 13 used to protect and support the optical film is generally epoxy resin or silica gel, with a refractive index between 1.4 and 1.5. When entering the light-thinning medium, the light at a large angle will be totally reflected, and most of the light at a large angle will be irradiated at the junction of the LED chip and the LED chip, which will cause uneven brightness of the backlight, and the junction of the LED chip and the LED chip will be dark, affecting The brightness and light efficiency of the corresponding position at the junction of the two LED chips

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