A high-efficiency heat dissipation device for ultra-high heat flux density electronic devices

Abstract

The invention discloses a high-efficiency heat dissipation device for ultra-high heat flux electronic devices, which includes a cold plate substrate, an embedded heat dissipation module and fasteners, and the embedded heat dissipation module is fixed on the cold plate substrate through the fasteners; inside the cold plate substrate An internal flow channel is provided, and the coolant inlet and coolant outlet at both ends of the internal flow channel are set on the cold plate base plate. There are several installation interfaces on the cold plate base plate. The installation interface is an inner groove opening, and the inner groove opening is provided with The liquid inlet and the liquid outlet, and the internal space of the inner groove are communicated with the internal flow channel through the liquid inlet and the liquid outlet; the embedded heat dissipation module cooperates with the installation interface and seals the installation interface to form a closed space through flange sealing; the present invention is due to the It can save a layer of contact thermal resistance and thus greatly reduce the operating temperature of the chip. The heat dissipation device can solve the local heat flux density up to 1000W / cm 2 The device heat dissipation problem has a wide range of application prospects.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a high-efficiency heat dissipation device for ultra-high heat flux density electronic devices. Background technique [0002] The reliability of electronic equipment components decreases as their operating temperature increases. The "10°C rule" clearly points out that for every 10°C increase in the temperature of a semiconductor device, its reliability will decrease by 50%, and this failure will continue to increase with the increase of temperature. If the operating temperature of electronic equipment reaches 70°C~ 80°C, the reliability will drop by 10% for every 1°C increase in the operating temperature, so good heat dissipation is a necessary condition to ensure the normal operation of electronic equipment. [0003] In recent years, with the development and progress of technology, electronic equipment components are required to obtain better per...

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Problems solved by technology

However, in general, in order to ensure the maintainability of the equipment and the replacement of the device, the electronic device and the cold plate are generally installed in a detachable way such as screwing or gluing, which will cause a huge interface heat between the two. Although the interface thermal resistance can be reduced by using high thermal conductivity pads, thermal conductive silicone grease, graphene, etc., they all face one of limited effects, long-term working performance stability, process realization, space size, and economy. Or several problems. More importantly, although the interface material can reduce the interface contact thermal resistance, it still exists. When the heat flux density continues to increase, its ability will still be limited, so the above heat dissipation technology cannot cope with the future. For the heat dissipation requirements of ultra-high heat flux devices, the best way is to eliminate the contact thermal resistance of the contact interface

[0005] One of the technologies used internationally to eliminate thermal contact resistance at the interface is to directly solder high heat flux devices to the cold plate. The biggest problem with this method is when multiple high heat flux devices need to be welded on a liquid-cooled cold plate. , then if one of the components is damaged, it may cause damage to the entire electronic device, thereby greatly reducing the reliability of the device. Another method is to directly integrate the flow channel with the device housing, and each device housing has a The inlet and outlet of the cooling liquid and the complete internal flow channel directly flow into the housing through the cooling liquid to directly complete the cooling of the internal chip of the device. The advantage of adopting this structure is that there is no chip and The contact thermal resistance of the cold plate can also prevent equipment reliability problems caused by damage to a certain device, but this method will face the following problems: First, due to the need to form a complete flow channel, the structure of the chip after packaging must be in the thickness direction. There is a certain size to ensure that it has sufficient compressive strength and heat exchange area. Secondly, each chip package structure must have a cooling liquid inlet and outlet to communicate with the liquid cooling system, which will greatly increase the complexity of the system and reduce reliability. Again, if the integrated design of the cold plate and the packaging shell forms an independent flow channel, due to the limitation of size and processing technology, the form of the flow channel is greatly restricted and the internal heat exchange area is limited, which will affect its final heat dissipation effect. Finally, for the heat dissipation problem of high heat flux devices, it is necessary to adopt micro-channel heat dissipation technology. With this flow channel design technology, there is a risk of flow channel blockage during use. If a highly integrated design with independent flow channels inside the shell is adopted, It is difficult to effectively deal with blocked flow channels, which will lead to the failure of the entire device

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