Spray head transfer mechanism used for ink-jet spraying and drive method thereof

Abstract

The invention discloses a spray head transfer mechanism used for ink-jet spraying and a drive method thereof. The spray head transfer mechanism comprises a lifting assembly, a grabbing assembly, a perpendicular motion assembly, a horizontal motion assembly and the like. The spray head transfer mechanism is a three-axial motion spray head transfer mechanism, the lifting assembly drives the grabbingassembly to transfer a spray head module, and moves in the horizontal direction and the vertical direction; and the spray head transfer mechanism is used for classified placing of the spray head module and replacing of the spray heads during ink-jet printing. Besides, in a spray head transfer process, the spray head module is placed on multiple stations. The spray head transfer mechanism used forink-jet printing is simple in structure, adopts mechanical positioning, is convenient and accurate in control, and avoids damaging a spray nozzle by collision in a spray head transfer process. The spray heads of different colors further can be placed and taken out in a classified mode, so that the spray heads needed for ink-jet spraying are quickly replaced efficiently.

Description

technical field [0001] The invention relates to a nozzle transfer mechanism for inkjet printing and a driving method thereof, which are used in the technical field of printing electronic substrates, and more specifically relates to a nozzle transfer mechanism for inkjet printing. Background technique [0002] Printed electronics can greatly reduce the cost of manufacturing, and it is environmentally friendly. It has a profound impact on the manufacturing industry, but the impact on the printing industry cannot be underestimated. [0003] Printed electronics technology is a technology that prints circuits on plastic films or glass substrates. It is a green manufacturing technology that has the advantages of less material, low cost, no pollution, and high flexibility. It greatly simplifies the manufacturing process of electronic products and prepares Various types of products, such as ultra-thin, bendable, small or large or light-weight products. By using the screen printing ...

AI Technical Summary

Problems solved by technology

[0005] At present, for the existing printed electronic equipment on the market, the transfer and positioning of the substrate is carried out by manual unpacking, that is, the replacement of the nozzle needs to open the sealed box, and the manual positioning of the material is taken and fed; this method of picking and feeding not only wastes nitrogen. Moreover, the manual positioning is not accurate, and it cannot be placed in the specified position accurately.

Moreover, the speed of manual placement is slow and inefficient, which seriously affects the printing efficiency of the substrate

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