Silicon slice encasing mechanism

Abstract

The invention discloses a silicon slice encasing mechanism which comprises a silicon slice tightening module and two foam box pushing modules. The foam box pushing modules are symmetrically arranged on two sides of the silicon slice tightening module. A drive motor on the silicon slice tightening module enables a tightening screw rod to rotate through a coupler, and a lock nut arranged on the tightening screw rod drives a pressing plate structure to clamp or loosen the silicon slice. Drive motors II on the foam box pushing modules drive movable screw rods to rotate through couplers II, screw rod nuts arranged on the movable screw rods drive pushing guide rods to stretch out and draw back, and the pushing guide rods push a pushing plate to move forwards or move backwards, so that two half foam boxes on the two foam box pushing modules arranged symmetrically are combined, and the silicon slices on the foam box pushing modules are encased. The silicon slice encasing mechanism provided bythe invention is high in encasing efficiency and low in personnel dependency, and has the advantages of good integrity of encased silicon slices and low silicon slice encasing cost.

Description

technical field [0001] The invention relates to silicon wafer boxing equipment, in particular to a silicon wafer boxing mechanism. Background technique [0002] Since the silicon wafers are fragile, in order to avoid damage during transportation, the silicon wafers are packed in foam boxes, each box of silicon wafers is separated by foam, and a piece of corrugated cardboard is placed on the outermost layer, so that the silicon wafers The film is relatively static in the foam box, and there is foam cushioning protection during transportation to avoid collision damage. Because this "sandwich" boxing method is cumbersome, the traditional boxing method is still manual. The boxing efficiency is not high, and the personnel dependence is high, which increases the boxing cost. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a silicon wafer box packing mechanism in view of the above problems. [0004] The present invent...

AI Technical Summary

Problems solved by technology

[0002] Since the silicon wafers are fragile, in order to avoid damage during transportation, the silicon wafers are packed in foam boxes, each box of silicon wafers is separated by foam, and a piece of corrugated cardboard is placed on the outermost layer, so that the silicon wafers The film is relatively static in the foam box, and there is foam cushioning protection during transportation to avoid collision damage. Because this "sandwich" boxing method is cumbersome, the traditional boxing method is still manual. The packing efficiency is not high, the personnel dependence is high, and the packing cost is increased

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