Method, device and system for measuring material mechanical property information
A technology of attribute information and material mechanics, which is applied in the direction of measuring devices, analyzing materials, and using sound waves/ultrasonic waves/infrasonic waves for material analysis, etc. It can solve the problems of piezoelectric sensors that are difficult to measure motion signals, unsuitable materials or biological materials, and material layering unknown structure
A technology of attribute information and material mechanics, which is applied in the direction of measuring devices, analyzing materials, and using sound waves/ultrasonic waves/infrasonic waves for material analysis, etc. It can solve the problems of piezoelectric sensors that are difficult to measure motion signals, unsuitable materials or biological materials, and material layering unknown structure
CN110849970AActive Publication Date: 2020-02-28北京曦健科技有限公司
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[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Here, the exemplary embodiments and descriptions of the present invention are used to explain the present invention, but not to limit the present invention.
[0025] In the description of this specification, the words "comprising", "comprising", "having", "containing" and so on are all open terms, meaning including but not limited to. A description referring to the terms "one embodiment," "a particular embodiment," "some embodiments," "for example," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one of the present application. Examples or examples. In this specification, schematic representations of the above terms do not ne...
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The invention discloses a method, device and system for measuring material mechanical property information. The method includes the steps that excitation signals of different frequencies are loaded toa material to be measured; motion information of surface wave signals or interface wave signals of the material to be measured under different frequency excitation signals are measured, wherein the motion information includes wave velocity and dispersion information, and the surface wave signals or the interface wave signals are ultrasonic signals of the surface or internal interface of the material to be measured and collected by at least two ultrasonic transducers; the mechanical property information of the material to be measured is determined according to the motion information of the surface wave signals or the interface wave signals of the material to be measured under different frequency excitation signals; and the mechanical property information of the material to be measured is output. Based on the fact that the ultrasonic transducers measure the motion information of surface waves or interface waves of the material, the inversion of the mechanical property information of a thin film wrapping material or other wrapping materials or materials in a special environment is realized.
Description
technical field [0001] The invention relates to the field of material mechanical property measurement, in particular to a method, device and system for measuring material mechanical property information. Background technique [0002] This section is intended to provide a background or context to embodiments of the invention that are recited in the claims. The descriptions herein are not admitted to be prior art by inclusion in this section. [0003] As we all know, when a material is excited by external mechanics, there will be surface wave or interface wave signal propagation on the surface of the material and the interface of each phase inside the material. The propagation properties of surface wave and interface wave signals (such as wave velocity and dispersion characteristics) are closely related to the mechanical properties of the material itself. The signal signal is collected, and the collected signal is processed with a reasonable algorithm to invert the mechanica...
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Patent Timeline
28 Feb 2020
Publication
CN110849970A
- IPC
- G01N29/04; G01N29/07; G01N29/12; G01N29/44
- CPC
- G01N29/041; G01N29/043; G01N29/045; G01N29/07; G01N29/12; G01N29/44
- Inventors
- 曹艳平; 郑阳