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LED optical assembly and backlight module thereof

A technology of optical components and light sources, applied in optics, nonlinear optics, instruments, etc., can solve problems such as low luminous efficiency and easy return of light from LED chips, so as to improve luminous efficiency, market competitiveness, and installation stability sexual effect

Pending Publication Date: 2020-02-28
常州丰盛光电科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: in order to solve the problem that the LED chip on the bottom plate of the backlight module in the prior art is packaged and protected by a sealing process, so that the light of the LED chip is easy to return and the luminous efficiency is not high. An LED optical assembly, in addition, the present invention also provides a backlight module comprising the above-mentioned LED optical assembly

Method used

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  • LED optical assembly and backlight module thereof
  • LED optical assembly and backlight module thereof
  • LED optical assembly and backlight module thereof

Examples

Experimental program
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Embodiment 1

[0036] Such as Figure 1-5 As shown, an LED optical component includes a substrate 1, a transparent packaging plate 2 disposed on the substrate 1, and a plurality of light sources 3 distributed in an array on the substrate 1. The light sources 3 are mini LEDs. In fact, mini LEDs are also It refers to light-emitting diodes with a size between 50 μm and 150 μm. The side of the packaging board 2 close to the substrate 1 is provided with a plurality of accommodation cavities 2-1 for accommodating the light source 3. Each accommodation cavity 2-1 is at least Corresponding to one light source 3 , the light source 3 on the substrate 1 is located in the corresponding accommodation cavity 2 - 1 , and the accommodation cavity 2 - 1 shrinks gradually along the direction from the substrate 1 to the packaging board 2 .

[0037] All accommodating cavities 2-1 correspond to a single light source 3, and the packaging board 2 has channels 2-2 between two adjacent accommodating cavities 2-1 for...

Embodiment 2

[0046] The difference between embodiment 2 and embodiment 1 is: as Figure 6 and 7 As shown, each accommodating cavity 2-1 corresponds to a plurality of light sources 3 at the same time, and the accommodating cavities 2-1 on the packaging board 2 are distributed at intervals along the linear direction; There are several rows, and each row has several light sources 3, so that the airflow in the same accommodating chamber 2-1 can flow through multiple light sources 3 therein, and disperse the heat of each light source 3 in the same row of light sources 3, so that the substrate 1 The temperature of each light source 3 tends to be balanced, so as to avoid the phenomenon of damage caused by local high temperature of the light source 3 in the accommodation chamber 2-1, and improve the heat dissipation performance.

[0047] Such as Figure 6 , 9 As shown in and 10, the accommodating cavity 2-1 is elongated, and the cross section of the accommodating cavity 2-1 is triangular, trape...

Embodiment 3

[0052] A backlight module includes the LED optical assembly of the above-mentioned embodiment 1 or embodiment 2, and the backlight module is packaged in a liquid crystal screen to form a seal.

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Abstract

The invention relates to the technical field of LED optical assemblies, in particular to an LED optical assembly. In addition, the invention further relates to a backlight module comprising the LED optical assembly. The LED optical assembly comprises a substrate, a transparent packaging plate arranged on the substrate and a plurality of light sources distributed on the substrate in an array mode.A plurality of accommodating cavities for accommodating the light sources are formed in one side, close to the substrate, of the packaging plate; each accommodating cavity at least corresponds to onelight source; the light sources on the substrate are positioned in the corresponding accommodating cavities; according to the LED optical assembly provided by the invention, the light sources on the substrate are packaged by adopting the packaging plate with a plate structure; in cooperation with the design that the accommodating cavity is gradually shrunk, light emitted by the light source can irradiate the inner wall of the accommodating cavity again to be refracted when being reflected on the inclined inner wall of the accommodating cavity, so that reflected light on the inner wall of theaccommodating cavity is prevented from returning to the light source again, and therefore the light emitting efficiency is improved.

Description

technical field [0001] The present invention relates to the technical field of LED optical components, in particular to an LED optical component. In addition, the present invention also relates to a backlight module comprising the above-mentioned LED optical component. Background technique [0002] Mini LED, also known as mini LED or sub-millimeter light-emitting diode, refers to LEDs with a grain size of about 100 microns. It is an improved version based on traditional LED backlights. It has the advantage of high process yield and can be achieved with flexible substrates. The form of high-curved backlight adopts local dimming design, which has better color rendering and can bring more refined HDR partitions to LCD panels. It is suitable for use in mobile phones, TVs, car panels, gaming laptops and other products. [0003] At present, the LED chips on the backplane of the backlight module are generally protected by sealing glue, such as the light-emitting diode light board ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357
CPCG02F1/133603G02F1/133606G02F1/133608G02F1/133614
Inventor 冯晋荃葛伟新邵明燕李济常
Owner 常州丰盛光电科技股份有限公司