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Photosensitive glue composition, photosensitive conductive glue composition and electronic device containing photosensitive conductive glue composition

A technology of composition and photosensitive glue, which is applied in the direction of photosensitive materials, optics, and photomechanical equipment used in optomechanical equipment, and can solve the problems of incomplete hardening, rapid cracking, and rapid hardening of glue, etc.

Pending Publication Date: 2020-02-28
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the currently used photosensitive hardening adhesives will quickly crack the photoinitiator in the adhesive material under external light irradiation, and cause a crosslinking reaction between the resins to quickly harden the adhesive material.
However, with the requirements of multi-layer stacking and repeated processing between components in the packaging or OLED manufacturing process, if the components are directly pasted on the photosensitive adhesive, and then irradiated by external light, the photosensitive adhesive composition will be irradiated by the component's shielding light, so The adhesive cannot be fully hardened, causing problems in the reliability of the bonding of rear-end components or the bonding of packaging materials

Method used

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  • Photosensitive glue composition, photosensitive conductive glue composition and electronic device containing photosensitive conductive glue composition
  • Photosensitive glue composition, photosensitive conductive glue composition and electronic device containing photosensitive conductive glue composition
  • Photosensitive glue composition, photosensitive conductive glue composition and electronic device containing photosensitive conductive glue composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] In 30 parts by weight of SMA1000I resin, add 70 parts by weight of diethylene glycol divinyl ether (DEGDE) monomer, after mixing and dissolving by a public rotary mixer, add 5 parts by weight of photoacid type initiator 4-isopropyl Base-4'-methyldiphenyliodonium tetrakis (pentafluorophenyl) borate (4-Isopropyl-4'-methyldiphenyliodonium Tetrakis (pentafluorophenyl) borate) in SMA1000I resin and DEGDE monomer mixture.

Embodiment 2

[0078] The same procedure as described in Example 1 was performed except that the parts by weight of both the SMA1000I resin and the DEGDE monomer were changed to 50 parts by weight.

Embodiment 3

[0080] The same procedure as described in Example 1 was carried out, except that the parts by weight of the SMA1000I resin and the DEGDE monomer were changed to 70 parts by weight and 30 parts by weight, respectively.

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Abstract

The invention provides a photosensitive glue composition comprising 10-90 parts by weight of a monomer having a vinyl ether functional group; 10-90 parts by weight of tertiary amine polymer; and 0.5-10 parts by weight of photoacid type initiator, wherein the weight average molecular weight of the tertiary amine polymer is within 2000-20000. The invention also provides a photosensitive conductive glue composition and an electronic device containing the photosensitive conductive glue composition.

Description

【Technical field】 [0001] The invention relates to a photosensitive adhesive composition, and in particular to a photosensitive adhesive composition, a photosensitive conductive adhesive composition and an electronic device comprising the photosensitive conductive adhesive composition. 【Background technique】 [0002] Photosensitive adhesive compositions have been widely used in display assembly or OLED lighting packaging materials in recent years. Compared with the traditional method of curing the composition by heating and baking, the photosensitive adhesive composition only needs to be exposed to external ultraviolet light, electrons, etc. Electron beam (Electron Beam), infrared rays, X-rays and other light rays to harden the adhesive material. It is suitable for heat-sensitive soft polymer substrates, so it gradually replaces thermosetting compositions on flexible printed electronics. The use, and at the same time has the advantages of shorter process time, equipment simpl...

Claims

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Application Information

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IPC IPC(8): G03F7/029G03F7/004
CPCG03F7/029G03F7/004
Inventor 杨逸琦何首毅邱国展
Owner IND TECH RES INST
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