Transfer substrate and manufacturing method and transfer method thereof

A technology for transferring substrates and substrates, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as the inability to transfer MicroLEDs

Active Publication Date: 2020-02-28
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The application provides a transfer substrate, its manufacturing method

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  • Transfer substrate and manufacturing method and transfer method thereof
  • Transfer substrate and manufacturing method and transfer method thereof
  • Transfer substrate and manufacturing method and transfer method thereof

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Embodiment Construction

[0049]The application describes a number of embodiments, but the description is illustrative rather than restrictive, and it will be obvious to those of ordinary skill in the art that within the scope of the embodiments described in the application, There are many more embodiments and implementations. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are possible. Except where expressly limited, any feature or element of any embodiment may be used in combination with, or substituted for, any other feature or element of any other embodiment.

[0050] This application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The disclosed embodiments, features and elements of this application can also be combined with any conventional features or elements to form unique inventive solutions as defined by the claim...

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Abstract

The invention relates to a transfer substrate and a manufacturing method and a transfer method thereof. The transfer substrate comprises a first substrate and a second substrate. A via hole is arranged in the second substrate; an accommodating space is formed between the first substrate and the second substrate; and the accommodating space comprises a first channel and a second channel. Gas is accommodated in the first channel, and liquid is accommodated in the second channel; the contact angle of the liquid in the first channel is greater than an angle threshold value; and the gas in the first channel changes under the control of the first substrate to switch a contraction state and an expansion state. In the expansion state, the liquid in the second channel flows out from the via hole under the pushing of the gas to form a transfer head for picking up a to-be-transferred element, or the transfer head releases the to-be-transferred element to a target substrate; and in the contractionstate, negative pressure is formed in the first channel, and the transfer head is tightly attached to the to-be-transferred element under the action of the negative pressure, so that the transfer head can drive the to-be-transferred element to transfer. According to the invention, transfer of Micro LEDs can be realized.

Description

technical field [0001] This article relates to the field of display technology, in particular to a transfer substrate, a manufacturing method thereof, and a transfer method. Background technique [0002] Light Emitting Diode (LED) technology has been developed for nearly three decades, from the initial solid-state lighting power supply to the backlight source in the display field and then to the LED display screen, providing a solid foundation for its wider application. With the development of chip manufacturing and packaging technology, sub-millimeter light-emitting diode (Mini Light Emitting Diode, Mini LED) display of about 50 micron to 60 micron and micro light-emitting diode (Micro Light Emitting Diode, Micro LED) display of 15 micron or less have gradually become A hotspot of the display panel. Among them, Micro LED (also known as micro light-emitting diode uLED) display has significant advantages such as low power consumption, high color gamut, high stability, high r...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L27/15
CPCH01L21/6835H01L27/156H01L2221/68368
Inventor 宋晓欣吕志军姚琪张锋刘文渠董立文崔钊孟德天王利波
Owner BOE TECH GRP CO LTD
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