Transfer substrate and manufacturing method and transfer method thereof

A technology for transferring substrates and substrates, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as the inability to transfer MicroLEDs
CN110854057AActive Publication Date: 2020-02-28BOE TECH GRP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BOE TECH GRP CO LTD
Publication Date
2020-02-28

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Abstract

The invention relates to a transfer substrate and a manufacturing method and a transfer method thereof. The transfer substrate comprises a first substrate and a second substrate. A via hole is arranged in the second substrate; an accommodating space is formed between the first substrate and the second substrate; and the accommodating space comprises a first channel and a second channel. Gas is accommodated in the first channel, and liquid is accommodated in the second channel; the contact angle of the liquid in the first channel is greater than an angle threshold value; and the gas in the first channel changes under the control of the first substrate to switch a contraction state and an expansion state. In the expansion state, the liquid in the second channel flows out from the via hole under the pushing of the gas to form a transfer head for picking up a to-be-transferred element, or the transfer head releases the to-be-transferred element to a target substrate; and in the contractionstate, negative pressure is formed in the first channel, and the transfer head is tightly attached to the to-be-transferred element under the action of the negative pressure, so that the transfer head can drive the to-be-transferred element to transfer. According to the invention, transfer of Micro LEDs can be realized.
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Description

technical field

[0001] This article relates to the field of display technology, in particular to a transfer substrate, a manufacturing method thereof, and a transfer method. Background technique

[0002] Light Emitting Diode (LED) technology has been developed for nearly three decades, from the initial solid-state lighting power supply to the backlight source in the display field and then to the LED display screen, providing a solid foundation for its wider application. With the development of chip manufacturing and packaging technology, sub-millimeter light-emitting diode (Mini Light Emitting Diode, Mini LED) display of about 50 micron to 60 micron and micro light-emitting diode (Micro Light Emitting Diode, Micro LED) display of 15 micron or less have gradually become A hotspot of the display panel. Among them, Micro LED (also known as micro light-emitting diode uLED) display has significant advantages such as low power consumption, high color gamut, high stability, high r...

Claims

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