A packaging mechanism for a heat-dissipating double-base island dsop chip with an adjustable structure

Abstract

The invention relates to a package structure for a heat-dissipating double-base island DSOP chip with an adjustable structure, comprising an inner casing and a first chip package, a bottom plate is fixed at the lower end of the middle part of the inner casing, and a bottom plate is attached to the lower end of the bottom plate The heat dissipation plate, the first chip package is distributed on the top of the upper end of the base plate, and sleeping pillows are fixed on both sides of the upper end of the base plate, guides are opened on both sides of the top of the sleeping pillow, and the inner wall of the guides is attached with a clip pad , an outer shell is distributed on the outer wall of the upper end of the inner shell, and a top cover is attached to the top of the upper end of the outer shell. In the present invention, through the setting of the bottom plate, the two sides of the outer wall of the bottom plate are distributed in the shape of a "mountain". The entire inner shell and the bottom plate are used as the bottom protection structure, and are connected together by an embedded structure. The connection strength is high, and the mountain-shaped structure , has a good seal to prevent water molecules from flowing in, and its detachability is convenient for internal maintenance and user use.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging mechanism for a heat-dissipating double-base island DSOP chip with an adjustable structure. Background technique [0002] The double base island DSOP packaging mechanism is a form of packaging. When packaging the chip, a chip is attached to the two base islands inside. The base island and the chip are plastic-sealed inside the plastic package, and only the pins are exposed to prevent damage damage, and the two base islands are independent of each other, and the functions of the two chips are different, thereby reducing the volume of the product and helping to increase product functions. A good packaging mechanism can ensure that the chips are not mutually exclusive. Interference, while ensuring the formation of a complete whole. [0003] The existing packaging mechanism mostly adopts an integrated structure design in use, which is difficult to replace, and the...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a heat-dissipating double-base island DSOP chip packaging mechanism with an adjustable structure, to solve the above-mentioned background technology. The existing packaging mechanism adopts an integrated structure design in use, and its replacement is difficult. , and the pins are not conveniently inserted into the socket of the PCB board

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