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Transparent COF design method

A design method and transparent technology, applied in the field of COF, can solve problems such as poor line detection, inability to see COF lines, and affect product quality, and achieve the effects of improving product quality, high flexibility, and improving accuracy

Inactive Publication Date: 2020-03-06
江苏上达半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a transparent COF design method, which solves the problem that during the quality appearance inspection of the opaque PI layer, neither the microscope inspection nor the human inspection can see the internal lines of the COF, which will cause batch failure. Poor and missed inspection of the line seriously affects the quality of the product

Method used

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  • Transparent COF design method

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Embodiment

[0021] Such as figure 1 As shown, the embodiment of the present invention provides a transparent COF design method, the transparent COF is composed of a transparent PI layer and a copper foil layer;

[0022] The transparent COF includes the following preparation steps:

[0023] S1. Prepare a transparent PI layer, check the used transparent PI layer, and confirm that the transparent PI layer is not damaged, and the thickness of the transparent PI layer is 5 μm to 100 μm;

[0024] S2. Form the main copper foil layer on one side of the transparent PI layer by electroless copper plating, the thickness of the copper foil layer is 3 μm to 30 μm, and the transparent COF can be obtained;

[0025] S3. Detecting the prepared transparent COF to determine whether various properties of the transparent COF are qualified.

[0026] By using the transparent COF composed of transparent PI layer and copper foil layer, the internal circuit status can be clearly seen, which improves the accuracy...

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Abstract

The invention provides a transparent COF design method and relates to the technical field of COF. In the transparent COF design method, the transparent COF is composed of a transparent PI layer and acopper foil layer. The method for preparing the transparent COF includes the following steps: S1, preparing a transparent PI layer, checking the used transparent PI layer, and confirming that the transparent PI layer is not damaged; S2, plating copper by chemical deposit to form a main copper foil layer on one side of the transparent PI layer so as to obtain the transparent COF; and S3, testing the obtained transparent COF to determine whether the performance of the transparent COF is qualified. By using the transparent COF composed of the transparent PI layer and the copper foil layer, an internal circuit condition can be clearly seen, the accuracy of the internal circuit inspection of the COF can be improved, the occurrence of missed inspection can be greatly reduced, and the product quality can be improved. In addtion, unprecedented visual experience and new experience can be provided for users.

Description

technical field [0001] The invention relates to the technical field of COF, in particular to a transparent COF design method. Background technique [0002] COF is often called chip-on-chip film, which is a soft film construction technology that fixes integrated circuits (ICs) on flexible circuit boards. Refers to the flexible additional circuit board of unpackaged chips, including tape and reel packaging production (TAB substrate, whose process is called TCP), flexible board connection chip components, and flexible IC carrier board packaging. [0003] The conventional COF structure is composed of PI layer and copper foil layer. Because the metal layer itself is opaque, the PI layer of COF is not transparent, so the opaque PI material will seriously affect the inspection of the internal circuit of COF. Use the opaque PI layer in the quality and appearance inspection At the same time, neither the microscope inspection nor the human inspection can see the lines inside the COF,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/02
CPCH05K1/0346H05K3/022
Inventor 祁思瑞王健孙彬沈洪李晓华
Owner 江苏上达半导体有限公司
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