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Custom lead frame from standard plus printed lead frame portion

A technology of metal leads and metal traces, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of time-consuming, high LF design cost, etc., and achieve the effect of reducing quantity

Pending Publication Date: 2020-03-13
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

LF is usually designed together with IC die in a co-design process, the design includes mechanical, thermal, electrical modeling, which is time consuming and results in high LF design cost

Method used

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  • Custom lead frame from standard plus printed lead frame portion
  • Custom lead frame from standard plus printed lead frame portion
  • Custom lead frame from standard plus printed lead frame portion

Examples

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Embodiment Construction

[0012] Example embodiments are described with reference to the drawings, wherein like reference numerals are used to indicate similar or equivalent elements. The illustrated ordering of acts or events should not be considered limiting, as some acts or events may occur in different orders and / or concurrently with other acts or events. Furthermore, some of the illustrated acts or events may not be required to implement a methodology in accordance with the present disclosure.

[0013] figure 1 A simplified example custom LF 100 is shown showing its standard LF portion 110 with leads 110b on at least two sides, and a printed LF portion 120 coupled to the leads 110b of the standard LF portion 110 according to an example embodiment. There is usually some designed overlap between traces 120a of printed LF portion 120 and leads 110b to reflect manufacturing tolerances to ensure connections are reliably provided. Custom LF 100 is typically part of a custom LF strip comprising multipl...

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PUM

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Abstract

The invention discloses a custom lead frame from a standard plus printed lead frame portion, and discloses a packaged semiconductor device (200). The packaged semiconductor device (200) includes an ICdie (140) having bump (140a) features that are coupled to bond pads (140) flip chip attached to a custom LF (140). The custom LF includes metal structures including metal leads (110b) on at least twosides, and printed metal providing a printed LF portion including printed metal traces (120a) that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads (120b) configured for receiving the bump features including at least some of the printed metal traces (120a) coupled to the bond pads on the IC die. The IC die (120b) isflip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.

Description

technical field [0001] The present disclosure relates to leadframe packaging of semiconductor devices and the resulting packaged semiconductor devices. Background technique [0002] Various semiconductor chip packages are known which provide support for an integrated circuit (IC) chip or die and associated bond wires, provide protection from the environment, and enable surface mounting of the die to a printed circuit board (PCB) and Interconnect with printed circuit board. One conventional packaging configuration includes a lead frame (LF) with leads on at least two sides of the die pad. [0003] LF packages are well known and widely used in the electronics industry to house, mount and interconnect various ICs. Conventional LF strips are typically stamped from a sheet of flat metal (such as copper) and include multiple metal leads that pass through a rectangular frame that includes multiple consumable "dam-bars" during package manufacturing Temporarily held together aroun...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/56H01L23/31H01L23/495
CPCH01L21/4821H01L21/563H01L23/3107H01L23/49541H01L23/49582H01L21/4853H01L21/4867H01L23/49861H01L2224/16225H01L2924/181H01L2924/00012H01L23/4951H01L23/49537H01L23/49816
Inventor J·比托B·S·库克S·库默尔
Owner TEXAS INSTR INC
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