Signal link fault simulation test method
A technology of fault simulation and testing method, applied in electronic circuit testing, measuring electricity, measuring devices, etc., can solve the problems of high cost and low analysis efficiency, and achieve the effect of low cost, high reliability and reduced space occupation
Pending Publication Date: 2020-03-17
SUZHOU CHANGFENG AVIATION ELECTRONICS
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Problems solved by technology
[0005] The purpose of the present invention is to solve the above-mentioned deficiencies in the prior art, aiming at the problem of low efficiency and high cost of traditional input and output signal comparison analysis, and proposes a signal link fault simulation test method
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[0018] The invention provides a signal link fault simulation test method. The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings, so as to make it easier to understand and grasp.
[0019] A signal link fault simulation test method, such as figure 1 As shown, the PCB laminate is 10 layers, and the component model library in this case is as follows figure 1 As shown, a simulation tool for each layer is designed in the component model library. The simulation tool has several attribute items, including layer thickness, line width, and dielectric constant of the material. The impedance of each layer is controlled to about 50ohm.
[0020] The pre-simulation design of theoretical signals is carried out through simulation tools, the topology structure of signals is defined, the value range of components is selected, and a reasonable layout and routing strategy is selected.
[0021] According to the pre-simulati...
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The invention discloses a signal link fault simulation test method. The method comprises the following steps: establishing an element model library according to PCB lamination plates, designing a simulation tool for each lamination plate in the element model library and arranging a plurality of attribute items including the lamination thickness, line width and dielectric constant of a material inthe simulation tool; with the simulation tools, carrying out previous pre-simulation designing on a theoretical signal, defining a topological structure of the signal, selecting an element value interval, and selecting a reasonable layout and wiring strategy; completing wiring of PCB lamination plates based on the previous pre-simulation design and then carrying out fault simulation test analysis;carrying out broadening rule setting through the simulation tools to obtain a post-simulation design and carrying out simulation analysis adjustment on the completed signal line which does not accordwith the previous pre-simulation design; and locating a fault point by comparing performance parameters in the signal transmission process with the post-simulation design. According to the invention,the occupied space is reduced by combining the establishment of the element model library with the simulation tools to realize the integrity of signal link detection; and the cost is low and the detection is convenient and feasible.
Description
technical field [0001] The invention relates to a signal link fault simulation test method, which belongs to the technical field of signal link fault detection. Background technique [0002] With the rapid development of digital circuits, the transmission rate of signals continues to increase, and the transmission frequency of signals continues to increase. The delay of signal transmission lines has an increasing impact on the overall performance of digital circuits, and gradually becomes a key factor in determining signal quality. It mainly includes the reflection of the signal itself, the crosstalk between the signals and the delay of signal transmission, etc. Therefore, it is particularly important to simulate the fault detection of the signal link. [0003] Computer module crosstalk is mainly due to the on-line noise caused by the mutual inductance or mutual capacitance characteristics between signals. The mutual inductance between signals mainly causes coupling voltage,...
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IPC IPC(8): G01R31/28
CPCG01R31/2846
Inventor闻一鸣张杰李兵强刘泽郝亮魏英豪
OwnerSUZHOU CHANGFENG AVIATION ELECTRONICS