Slice grinding machine

Abstract

The invention relates to the field of silicon slice production equipment, and discloses a slice grinding machine. The slice grinding machine comprises a rack. A lower grinding disc is fixedly connected to the rack. A grinding motor is fixedly connected to the rack. An output shaft of the grinding motor is fixedly connected with a rotating disc. An upper grinding disc is arranged on the rotating disc in a lifting manner. A mounting slice is placed on the lower grinding disc. Containing holes used for containing silicon slices are formed in the mounting slice. A drive assembly used for driving the mounting slice to move is arranged on the rack. Feeding hole ways are formed on the upper grinding disc. An auxiliary sand blasting assembly is arranged between the lower grinding disc and the upper grinding disc. The slice grinding machine has the effect of improving grinding efficiency.

Description

technical field [0001] The invention relates to the technical field of silicon wafer production equipment, in particular to a wafer grinding machine. Background technique [0002] At present, in the production process of silicon wafers, the surface of silicon wafers needs to be polished by a grinding machine to remove the different damages caused by the slicing process and laser marking. [0003] In the existing wafer grinding machine, the grinding sand is spread on the surface of the silicon wafer through the through holes on the grinding disc, and the grinding sand on the surface of the silicon wafer is pressed by the grinding disc, thereby grinding the upper and lower sides of the silicon wafer. [0004] The above-mentioned existing technical solutions have the following defects: because the through holes on the grinding disc cannot be opened relatively densely, it is difficult to distribute the grinding sand on the surface of the silicon wafer more evenly, and the grindi...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned existing technical solutions have the following defects: because the through holes on the grinding disc cannot be opened relatively densely, it is difficult to distribute the grinding sand on the surface of the silicon wafer more evenly, and the grinding machine needs to run for a period of time before it can be used. The grinding sand is evenly distributed, which prolongs the grinding time of silicon wafers and reduces the grinding efficiency

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