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Embedded passive bridging chip and application thereof

An embedded and chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems beyond the design capability of the maximum wiring layer, and achieve the effect of meeting the transmission requirements

Pending Publication Date: 2020-03-24
58TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the increase of system complexity, traditional packaging may require more complex routing layer design, which may even exceed the maximum routing layer design capability

Method used

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  • Embedded passive bridging chip and application thereof
  • Embedded passive bridging chip and application thereof
  • Embedded passive bridging chip and application thereof

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Embodiment Construction

[0026] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0027] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. are all based on the orientation or positional relationship of the drawings in the specification, and are only for the convenience of describing the present invention. The invention and the simplified description do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the present invention.

[0028] In the description of the present invention, i...

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Abstract

The invention discloses an embedded passive bridging chip, at least one U-shaped conductive connecting wire is arranged in the embedded passive bridging chip, and the left end and the right end of theU-shaped conductive connecting wire are connected to the same outer chip or two outer chips respectively. According to the embedded passive bridging chip, interconnection between chips, interconnection between the chips and a packaging substrate or a PCB, and high-density connection of each layer in the packaging substrate can be realized; different line widths can be adopted to meet the transmission requirements of different signals; and extra wiring design is not needed.

Description

technical field [0001] The invention belongs to the technical field of packaging and interconnection of integrated circuits, and in particular relates to an embedded passive bridge chip and its application. Background technique [0002] With the expansion of integrated circuit manufacturing technology to smaller process nodes, it is becoming more and more difficult to design the entire system on a single integrated circuit chip, and it is very time-consuming and expensive. One package multiple chips together to realize the system function Packaging solutions that contain multiple chips are on the rise, sometimes referred to as system-in-package (SiP), multi-chip modules (MCM), or multi-chip packages. As the complexity of the system increases, traditional packages may require more complex routing layer design, and may even exceed the maximum routing layer design capability. [0003] Therefore, an embedded passive bridge chip and its application urgently need to be proposed. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/538
CPCH01L23/5384H01L23/5386
Inventor 肖志强黎蕾孙晓冬丁涛杰
Owner 58TH RES INST OF CETC