Combined circuit board chemical treatment line equipment and treatment method thereof

Abstract

The invention discloses combined type circuit board chemical treatment line equipment. The equipment comprises a machine frame. A front section machining groove and a rear section machining groove areformed in the rack in a bilateral symmetry mode. A transfer mechanism is arranged between the front-section machining groove and the rear-section machining groove. The rack is provided with a front processing and conveying mechanism corresponding to the front-section processing groove. The invention provides combined type circuit board chemical treatment line equipment. The equipment has a front-section machining groove and a rear-section machining groove, and a transfer mechanism is arranged between the front-section machining groove and the rear-section machining groove. The machining sections of the line bodies are sequentially arranged through the transfer mechanism, and then the line bodies are arranged in parallel, the middles of the line bodies are connected through the transfer mechanism, and the head ends and the tail ends of the line bodies are connected with the transfer mechanism. The equipment performs common post-processing, unloads plates, folds plates, and performs post-processing of clamps. An independent line body is arranged and connected with a machining line body through a transfer mechanism, line body sharing of the same technological process is achieved, andmachining processes and devices with different machining effects are distributed through the transfer mechanism.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, in particular to a combined circuit board chemical processing line equipment and a processing method thereof. Background technique [0002] There are many types of circuit board electroplating, including electroplating copper, electronickel, electrotin, electroplating gold, etc., and there are many types of circuit board surface treatment, including chemical immersion gold, chemical immersion tin, chemical immersion nickel, immersion silver and so on. At present, the electroplating or surface treatment line used for circuit board production is generally set to a single line body mode, and the surface treatment process requires an independent line body for processing. Electroless copper plating, chemistry is each kind of electroplating or surface; the existing technology has the following defects: 1. The single wire body occupies a large area, and each electroplating line is about...

AI Technical Summary

Problems solved by technology

Electroless copper plating, chemistry is each kind of electroplating or surface; the existing technology has the following defects: 1. The single wire body occupies a large area, and each electroplating line is about 14 meters long and 5 meters wide, which is not conducive to space Utilization; 2. Different electroplating or surface treatment processes are processed separately, which is not conducive to the integration and utilization of the same process; 3. Single-line body processing, equipment costs are relatively large, and equipment installation and placement occupy a large space; 4. Single-line body processing, maintenance The cost of time, materials, labor and other aspects is relatively high; 5. If the processes are not consistent, it is necessary to repeatedly take out boards, put in boards, and transport, which may easily cause problems such as oxidation, scratches, or even scrapping of products

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