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Method for manufacturing mounting device and semiconductor device

A packaging device and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric heating devices, etc., can solve problems such as difficulty in properly heating semiconductor chips, and achieve the effects of heat input suppression and heat transfer suppression

Pending Publication Date: 2020-03-24
SHINKAWA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a case, it is difficult to properly heat the semiconductor chip in the lowermost layer of the temporary laminate only by using the heat from the head.

Method used

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  • Method for manufacturing mounting device and semiconductor device
  • Method for manufacturing mounting device and semiconductor device
  • Method for manufacturing mounting device and semiconductor device

Examples

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Embodiment Construction

[0036] Hereinafter, a method of manufacturing a semiconductor device and the packaging device 100 will be described with reference to the drawings. figure 1 It is a figure which shows the structure of the packaging apparatus 100. The packaging device 100 is a device for packaging the semiconductor chip 12 on the substrate 30 . The above-mentioned packaging device 100 is a particularly preferable configuration when a plurality of semiconductor chips 12 are stacked and packaged. In addition, in the following description, among the laminated bodies in which a plurality of semiconductor chips 12 are stacked, a laminated body in which a plurality of semiconductor chips 12 constituting the laminated body is in a temporarily pressure-bonded state is referred to as a "temporary laminated body STt", The stacked body in which the plurality of semiconductor chips 12 are in the final pressure-bonded state is called "chip stacked body STc" for distinction.

[0037] The packaging apparatu...

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Abstract

A mounting device is for manufacturing a semiconductor device by bonding a semiconductor chip 12 to a mounting body that is another semiconductor chip 12 or a substrate 30. The mounting device is provided with a stage 120 on which the substrate 30 is placed, a mounting head 124 that is able to move relative to the stage 120 and bonds the semiconductor chip 12 to the mounting body, and an irradiation unit 108 that emits electromagnetic waves that transmit through the stage and heat the substrate 30 from the lower side of the stage 120. The stage 120 has a first layer 122 formed on the upper surface side. In the first layer 122, the thermal resistance in the surface direction is greater than the thermal resistance in the thickness direction.

Description

technical field [0001] This specification discloses a packaging device for manufacturing a semiconductor device by bonding a semiconductor chip to a substrate or another packaged object of the semiconductor chip, and a method for manufacturing the semiconductor device. Background technique [0002] In the case of bonding a semiconductor chip to a substrate or other semiconductor chip, the semiconductor chip is usually heated and pressed using a heated encapsulation head. However, it is difficult to properly heat the semiconductor chip to be bonded using only the heat from the head. In particular, in recent years, in order to achieve higher functionality and miniaturization of semiconductor devices, it has been proposed to stack and package a plurality of semiconductor chips. In such a case, in order to shorten the time of the packaging process, the plurality of semiconductor chips may be laminated while being temporarily pressure-bonded, and then the plurality of semiconduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L25/065H01L25/07H01L25/18
CPCH01L25/065H01L25/07H01L25/18H01L2224/73104H01L2224/83191H01L2224/81191H01L21/67144H01L21/67115H01L24/75H01L2224/75262H01L2224/7598H01L2224/75983H01L2224/16227H01L2224/32225H01L2224/7565H01L2224/75822H01L2224/81201H01L2224/83201H01L2224/75252H01L2224/9211H01L2224/9205H01L2224/83871H01L2224/81224H01L2224/83986H01L2224/81986H01L24/81H01L24/83H01L24/92H01L2224/75253H01L2224/05599H01L2224/131H01L2224/2919H01L2224/81H01L2224/83H01L2224/83204H01L2224/8385H01L2924/00014H01L2924/0665H01L2924/0635H01L2924/0675H01L2924/0685H01L2924/07H01L24/89H01L21/324H05B6/00H01L25/0657H01L25/0655H01L21/50H01L24/80H01L24/94H01L2021/60105
Inventor 中村智宣前田彻高野彻朗
Owner SHINKAWA CO LTD
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