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Flexible circuit board, printed circuit board, rigid-flex board and manufacturing method thereof

A flexible circuit board and printed circuit board technology, which is applied in the electronic field, can solve problems affecting device reliability and poor signal quality, and achieve the effects of increasing solder penetration, reducing the probability of reflection, and adjusting the range of impedance

Active Publication Date: 2020-03-27
WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In related technologies, the quality of the signal transmitted in the rigid-flex board is poor, which affects the reliability of devices equipped with the rigid-flex board

Method used

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  • Flexible circuit board, printed circuit board, rigid-flex board and manufacturing method thereof
  • Flexible circuit board, printed circuit board, rigid-flex board and manufacturing method thereof
  • Flexible circuit board, printed circuit board, rigid-flex board and manufacturing method thereof

Examples

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Effect test

example 1

[0102]Since the 25G Directly Modulated semi-conductor Laser (DML) transmits high-speed signals, the differential impedance of the link is required to be 50 ohms. In the prior art, there is a sudden change in impedance at the soldering point of the flexible circuit board and the brushable circuit board, which will cause signal reflection, which in turn will affect the quality of the 25G link signal and cause the optical device to fail to work normally.

[0103] The rigid-flex board 3000 provided in this example can be applied to signal transmission in the field of optical communication. For example, it can be applied in light emitting components. Specifically, it can be applied to 25G directly modulated lasers.

[0104] Taking the application of Rigid-Flex board 3000 in 25G direct modulation laser as an example, refer to Figure 4a , the first ground sub-pad 1111 , the first differential signal sub-pad 1121 , the second differential signal sub-pad 1122 , and the second ground...

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PUM

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Abstract

The embodiment of the invention discloses a flexible circuit board, a printed circuit board, a rigid-flex board and a manufacturing method of the rigid-flex board. The flexible circuit board comprises: a first bonding pad which is connected with a signal line and is provided with at least two through holes, and the at least two through holes for realizing impedance matching between the first bonding pad and the signal line.

Description

technical field [0001] The embodiments of the present invention relate to the field of electronic technology, and in particular to a flexible circuit board, a printed circuit board, a rigid-flex board and a manufacturing method thereof. Background technique [0002] The Rigid-Flex board is an electronic product formed by electrically connecting the Flexible Printed Circuits (FPC) and the Printed Circuits Board (PCB) for the connection and transmission of electrical signals. [0003] In the related art, the signal quality transmitted in the rigid-flex board is poor, which affects the reliability of devices provided with the rigid-flex board. Contents of the invention [0004] In view of this, embodiments of the present invention provide a flexible circuit board, a printed circuit board, a rigid-flex board and a manufacturing method thereof. [0005] According to a first aspect of an embodiment of the present invention, a flexible circuit board is provided, including: [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/36H05K3/40
CPCH05K1/0215H05K1/0251H05K1/111H05K1/117H05K1/118H05K3/363H05K3/4007H05K2201/058H05K2201/09481
Inventor 陈洲胡方衍王晶郑庆立周杰
Owner WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
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