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Processing method of locally electroplated thick gold product

A local electroplating and processing method technology, applied in the reinforcement of conductive patterns, removal of conductive materials by chemical/electrolytic methods, electrical components, etc., can solve the problem of high cost

Pending Publication Date: 2020-03-27
CHENGDU AEROSPACE COMM EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Gold is a precious metal, and the gold plating process is more expensive than other electroplating processes

Method used

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  • Processing method of locally electroplated thick gold product
  • Processing method of locally electroplated thick gold product
  • Processing method of locally electroplated thick gold product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] A process method for local electroplating thick gold microwave printed board processing, including the following content:

[0036] 1. Process design

[0037] Combined with the existing process of wire electroplating with thick gold, after the first electroplating of the microwave printed board, the imaging process of the local gold-plated area is added, and on this basis, the local area is electroplated for the second time, and finally the surface coating is removed, and the process is removed by etching Wire, the specific process is as follows:

[0038] Engineering document processing→cutting→…normal multi-layer board or double-sided board process…→imaging→electroplating→etching and stripping tin→gold watch repair→printing and pasting solder mask→process wire imaging→first step of electroplating gold→partial gold plating imaging → The second step is electroplating gold → gold layer thickness test / hardness test → solder mask removal → etching process wire → gold watch ...

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Abstract

The invention discloses a processing method of a locally electroplated thick gold product, which is combined with an existing process wire thick gold electroplating process, a local gold electroplating area imaging process is added after a microwave printed board is electroplated with gold for the first time, secondary gold electroplating is carried out on a local area on the basis, finally, a surface coating is removed, and a process wire is removed by etching. Compared with the prior art, the high-frequency microwave printed board processing technology method for locally electroplating thickgold can be suitable for processing high-frequency microwave printed board products with inconsistent gold plating layer thicknesses in patterns, an electroplating area is limited mainly through a special means, and secondary gold plating is carried out in combination with a wire electroplating mode, so that the purpose of thickening a local gold plating layer is achieved.

Description

technical field [0001] The invention relates to the technical field of high-frequency microwave printed board manufacturing, in particular to a local electroplating thick gold process. Background technique [0002] With the increasing development of the communication industry, the application of high-frequency microwave printed boards has gradually grown. And with the increasing refinement of electronic products, the gold wire bonding process, as a new type of micro-assembly welding process, is more and more widely used in high-frequency microwave printed boards. Compared with the traditional process, the gold wire bonding process directly connects the gold wire to the gold layer on the surface of the printed board by pressure welding instead of soldering. Therefore, it is also required to plate a layer of gold with a certain thickness on the surface of the high-frequency microwave printed board. [0003] The traditional method of electroplating thick gold on high-frequenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24H05K3/28H05K3/06
CPCH05K3/24H05K3/282H05K3/06H05K2203/052H05K2203/163
Inventor 刘厚文陈丁琳马忠义付学明
Owner CHENGDU AEROSPACE COMM EQUIP CO LTD
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