CVD device tail gas treatment device

Abstract

The invention relates to the field of semiconductor manufacturing, in particular to a CVD device tail gas treatment device. The treatment device can increase the contact area of tail gas and water andtreat the tail gas by combining a water curtain and an adsorption structure, thereby effectively solving the problem of poor treatment effect due to the fact that only the water curtain is used in the past. The device comprises a high-temperature reaction barrel, a gas inlet pipe is arranged at the top of the high-temperature reaction barrel, the bottom of the high-temperature reaction barrel iscommunicated with the right side of a first treatment barrel through a first connecting pipe, the top of the first treatment barrel is connected to the right end part of a second treatment barrel through a second connecting pipe, a first adsorption device is arranged in the first treatment barrel above a first spraying pipe, and a vertical second adsorption device is further arranged in the middleof the second treatment barrel. The device is simple to operate, convenient to use and suitable for various places.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a CVD device tail gas treatment device. Background technique [0002] With the advancement of science and technology and the development of society, my country's electronic technology has developed rapidly, followed by the rapid development of semiconductor technology. In the CVD semiconductor manufacturing process, a large amount of exhaust gas will be discharged, which contains a large amount of harmful substances. If it is not treated, it will cause great harm to the staff and the surrounding environment. [0003] Existing tail gas treatment devices usually use spraying devices. The existing spraying devices usually generate a water curtain at the bottom of the spray pipe, and contact the tail gas through the water curtain. However, in the actual application process, the existing The sprinkler device can't fully mix the water and exhaust gas, because the treatment e...

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a CVD device tail gas treatment device, which can increase the contact area between tail gas and water, and adopts a combination of water curtain and adsorption structure to treat tail gas, effectively solving the problem of In the past, the problem of poor effect was only solved by water curtain

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