Mounting components and advancing devices for operating ambient sensors
A technology for installing components and the surrounding environment, which is applied in the directions of measuring instrument components, instrument components, and instrument cooling to achieve the effect of improving heat dissipation and cooling performance.
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[0026] figure 1 An embodiment of a mounting assembly 100 according to the first aspect of the invention is shown. In this case, the ambient sensor is connected in a thermally conductive manner to the heat-conducting section 120 . Furthermore, the heat-conducting section 120 is connected in a thermally-conductive manner to the thermal interface 130 . In this embodiment, the thermal interface 130 is designed as a heat sink with a large surface area with a small structural volume.
[0027] figure 2 Another embodiment of a mounting assembly 200 according to the first aspect of the invention is shown. In this embodiment, ambient sensor 210 is arranged in heat-conducting housing 260 . In this case, the outer side of the housing 260 can be surrounded by thermal insulation. The ambient environment sensor 210 is connected to the inner side of the outer wall of the casing 260 via the thermal connection device 240 . The outer wall preferably comprises a material that conducts heat...
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