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Mounting components and advancing devices for operating ambient sensors

A technology for installing components and the surrounding environment, which is applied in the directions of measuring instrument components, instrument components, and instrument cooling to achieve the effect of improving heat dissipation and cooling performance.

Pending Publication Date: 2020-04-03
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the sensors themselves dissipate their own heat during operation, which means additional thermal load

Method used

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  • Mounting components and advancing devices for operating ambient sensors
  • Mounting components and advancing devices for operating ambient sensors
  • Mounting components and advancing devices for operating ambient sensors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] figure 1 An embodiment of a mounting assembly 100 according to the first aspect of the invention is shown. In this case, the ambient sensor is connected in a thermally conductive manner to the heat-conducting section 120 . Furthermore, the heat-conducting section 120 is connected in a thermally-conductive manner to the thermal interface 130 . In this embodiment, the thermal interface 130 is designed as a heat sink with a large surface area with a small structural volume.

[0027] figure 2 Another embodiment of a mounting assembly 200 according to the first aspect of the invention is shown. In this embodiment, ambient sensor 210 is arranged in heat-conducting housing 260 . In this case, the outer side of the housing 260 can be surrounded by thermal insulation. The ambient environment sensor 210 is connected to the inner side of the outer wall of the casing 260 via the thermal connection device 240 . The outer wall preferably comprises a material that conducts heat...

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Abstract

The invention relates to a mounting assembly (100, 200, 300, 400), which is arranged for operating an ambient environment sensor (110, 210, 410) arranged in the top area (360) of a preceding device (310). The mounting assembly (100, 200, 300, 400) includes a thermally conductive section (120, 220, 320, 420) and a thermal interface (130, 230, 330, 430). The thermal interface (130, 230, 330, 430) isconfigured to extend into the internal space (340) of the forward device (310), and the volume of the internal space (340) of the preceding device (310) is thermally connected to the thermal interface (130, 230, 330, 430).

Description

technical field [0001] The invention relates to a mounting assembly for operating an ambient sensor and a travel device, wherein the mounting assembly serves in particular to improve heat dissipation. Background technique [0002] Depending on the function, the surroundings sensor is mounted on or in the housing of the preceding element. Depending on the type of sensor, it is advantageous or even necessary to install the sensor in a high installation position, so that the sensor can achieve a good panoramic view. Therefore, the environmental sensor is preferably mounted on top of the preceding device. This exposed position causes the ambient sensor to be subjected to environmental influences. By means of a correspondingly suitable housing, the ambient sensor can be shielded from the various environmental influences mentioned, such as dust and moisture. However, it is almost impossible to shield the ambient sensor from thermal influences, such as direct sunlight and sunlig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B60R16/02G01C3/02G01S7/481G12B15/00
CPCB60R16/02G01C3/02G01S7/481G12B15/00G01S7/4813G01D11/24G01S17/931H05K7/20154H05K7/20872G01D11/245H05K5/0213
Inventor M·卡米尔S·博加茨舍尔
Owner ROBERT BOSCH GMBH