Small size sheet die cutting process

A small-sized, die-cutting technology, which is applied in metal processing and other directions, can solve the problems of increased carrier film consumables, increased carrier film weight, and sheet product dropouts, so as to reduce consumption, prevent chip dropouts, and facilitate waste discharge Effect

Active Publication Date: 2021-09-17
深圳安洁电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, considering the light weight of the small-size sheet, it is easy to cause the sheet product to fall off during waste discharge, and then the weight of the carrying film needs to be increased to prevent the carrying film from being lifted up during waste discharge, which will cause the Increase in consumables

Method used

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  • Small size sheet die cutting process
  • Small size sheet die cutting process
  • Small size sheet die cutting process

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] Such as figure 2 As shown, the small-size sheet die-cutting process of the present embodiment includes the following steps:

[0027] S1. Lay the material tape on the carrier film and transport it to the downstream for the first die-cutting.

[0028] S2. Carry out the first die-cutting through the first row of knives 1 to form the first outline of the small-size sheet, and during the time period between two adjacent die-cutting actions, the walking of ...

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Abstract

The invention provides a small-size sheet die-cutting process, which includes the following steps: S1, attaching the material tape to the carrier film, and transporting it to the downstream for the first die-cutting; S2, performing the second die-cutting through the first row of knives One-time die-cutting to form the first profile of the small-size sheet; S3, remove the first waste area; S4, convey the carrier film and its feeding belt after the first die-cut to the downstream for the second die-cut Cutting; S5, carry out the second die-cutting by the second row of knives to form the second profile of the small-size sheet, and form the finished product of the small-size sheet through the formed first profile and the second profile; S6, exclude the second waste area. The invention realizes the step-by-step molding of the product and synchronous waste discharge through the steps of twice die-cutting and waste discharge, which is beneficial to waste discharge and prevents the occurrence of the problem of chip dropping. In addition, while improving the efficiency of the die-cutting process, it also reduces the amount of the carrier film and reduces the cost of the process.

Description

technical field [0001] The invention relates to a die-cutting process, in particular to a die-cutting process applied to small-size sheets on mobile phones. Background technique [0002] In the mobile phone manufacturing process, it is necessary to use some small-sized sheets (such as figure 1 A small-sized sheet shown in ) is used as an auxiliary material in the internal components of the mobile phone to achieve heat insulation and shock absorption. At present, during the production and processing of the above-mentioned sheet products, the forming of the sheet products is mainly realized by one-time die-cutting. Then according to the position of the product, use gaskets or jigs to discharge the waste. At the same time, considering the light weight of the small-size sheet, it is easy to cause the sheet product to fall off during waste discharge, and then the weight of the carrying film needs to be increased to prevent the carrying film from being lifted up during waste dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26F1/38B26F1/44
CPCB26F1/38B26F1/44B26F2001/4463
Inventor 王春生曾磊鸿
Owner 深圳安洁电子有限公司
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