Method for embedding copper block of double-sided circuit board

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a method for embedding a copper block of a double-sided circuit board, which comprises the following steps of: preparing a double-sided copper-clad plate; pasting high-temperature adhesive tapes on two sides of the double-sided copper-clad plate in a whole surface manner; milling a through hole in the double-sided copper-clad plate coated with the high-temperature adhesive tape; putting the copper block into the through hole; sequentially placing prepregs and first copper foils on the two outer sides of the double-sided copper-clad plate in which the copper blocks are placed from inside to outside, and carrying out high-temperature pressing; after pressing, tearing off the first copper foil, the prepreg and the high-temperature adhesive tape; and grinding off the residual PP glue on the surfaces of the double-sided copper-clad plate and the copper block. According to the method, for the double-sided circuit board, the gap between the double-sided copper-clad plate and the copper block is filled by utilizing the fluidity of prepregs during high-temperature lamination, so that the risk of medicine liquid hiding due to recession caused by insufficient glue filling is avoided; and through lamination and board grinding, the two sides of the copper block can be ensured to be flush with the two sidesof the double-sided copper-clad board, and subsequent circuit board processing is facilitated.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing double-sided circuit boards embedded with copper blocks. Background technique [0002] With the development of the electronic industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher, so the problem of heat dissipation is particularly important. In order to solve the heat dissipation problem of the circuit board, it is generally adopted to embed copper blocks on the circuit board, make blind slots on the copper blocks by CNC milling machine, and directly mount the heating components into the blind slots of the copper blocks. The copper block conducts out to meet the heat dissipation requirements. [0003] The existing method for embedding copper blocks in circuit boards is to drill grooves on the base material, the size of which is greater than the size of the copper blo...

AI Technical Summary

Problems solved by technology

However, due to the heat in the lamination process, the resin tends to shrink, and the size of the slot embedded in the copper block is large. Usually, the resin flows out of the slot and the resin in the slot cannot meet the filling requirements, resulting in a depression between the copper block and the substrate, resulting in During the subsequent process, it is easy to hide the liquid medicine in the depression to corrode the substrate and copper block.

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