Method for embedding copper block of double-sided circuit board
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 珠海杰赛科技有限公司
- Publication Date
- 2020-04-10
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing double-sided circuit boards embedded with copper blocks. Background technique
[0002] With the development of the electronic industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher, so the problem of heat dissipation is particularly important. In order to solve the heat dissipation problem of the circuit board, it is generally adopted to embed copper blocks on the circuit board, make blind slots on the copper blocks by CNC milling machine, and directly mount the heating components into the blind slots of the copper blocks. The copper block conducts out to meet the heat dissipation requirements.
[0003] The existing method for embedding copper blocks in circuit boards is to drill grooves on the base material, the size of which is greater than the size of the copper blo...