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Single-phase submerged liquid-cooled cabinet

An immersed, liquid-cooled technology, used in cooling/ventilation/heating renovation, electrical components, electrical equipment structural parts, etc., which can solve the problems of cluttered arrangement of heating elements, waste of cooling capacity, mutual shielding, etc.

Active Publication Date: 2021-06-04
ECO ATLAS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally, when the single-phase immersion liquid cooling technology is applied, it only drives the coolant to flow in from the liquid inlet of the electronic information equipment and flow out from the liquid outlet of the electronic information equipment. The heating element and the secondary heating element perform heat exchange without distinguishing between the main heating element and the secondary heating element, resulting in inaccurate cooling supply and a certain amount of cooling waste
In addition, due to the large cross-sectional area of ​​the internal circulation of electronic information equipment and the disorderly arrangement of heating elements and mutual shielding, the actual flow rate of the cooling liquid is low and cannot effectively and fully exchange heat with the main heating elements

Method used

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  • Single-phase submerged liquid-cooled cabinet
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  • Single-phase submerged liquid-cooled cabinet

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Embodiment Construction

[0037] In order to make the objects, technical solutions and advantages of the present invention, the present invention will be described in further detail below with reference to the accompanying drawings, and the described embodiments are merely the embodiments of the invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0038] Embodiments of the present invention provide a single-phase immersion liquid cooling cabinet, which is forced and concentrated by cooling liquid separators into the heat sink for heat dissipation, and improves the cooling effect.

[0039] The single-phase immersion liquid cooling cabinet includes a cabinet, a cabinet having a supply line, a liquid return line, and a space for accommodating a coolant and a plurality of electronic information devices, wherein the main electronic information device contains main...

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Abstract

The invention relates to the technical field of heat dissipation of electronic information equipment, and discloses a single-phase submerged liquid-cooled cabinet, which includes a cabinet body, which is provided with a liquid supply pipeline, a liquid return pipeline, and a cooling liquid and a plurality of electronic information equipment. The space of the equipment; also includes: the coolant liquid distributor located in the cabinet, the coolant liquid distributor is connected with the liquid supply pipeline, and is provided with a liquid distribution port corresponding to a plurality of electronic information equipment; it is set in each The radiator inside the electronic information equipment is used to dissipate heat for the main heating element. The radiator is attached to the surface of the main heating element and has a cooling liquid flow channel, and the liquid inlet of the radiator is connected with the corresponding liquid distribution port. The liquid outlet of the radiator communicates with the inner space of the corresponding electronic information equipment.

Description

Technical field [0001] The present invention relates to the field of heat dissipation techniques of electronic information equipment, and more particularly to a single-phase immersion liquid cooling cabinet. Background technique [0002] With the advancement of scientific and technological progress, big data technology is booming, and the performance requirements of electronic information equipment are increasing, and the performance improvement will bring the heat generation and heat flow density of electronic components. If the heat generated during the operation of the electronic component is not timely Take away, the internal temperatures of these components will rise rapidly, and the reliability of electronic components is very sensitive, which brings severe challenges to traditional low-efficiency air-cooled techniques, so liquid cooling technology has gradually become high-density electronic information equipment. Hotspots in heat dissipation technology. [0003] Generally...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20236
Inventor 李棒陈前林智
Owner ECO ATLAS SHENZHEN CO LTD