A circuit board semiconductor solder joint detection equipment

Abstract

The invention discloses circuit board semiconductor tin soldering welding spot detection equipment. The equipment comprises a bottom plate, a supporting column is fixed to the upper end face of the bottom plate. The upper end of the supporting column is fixedly connected with a fixing table. A moving cavity with the upper end wall and the lower end wall communicating with the external space is formed in the fixed table. The rear end wall of the moving cavity is fixedly connected with a first electric guide rail; a moving block capable of being driven by the first electric guide rail to move left and right is slidably connected into the moving cavity. A rotating cavity with a downward opening is formed in the moving block; the upper end wall of the rotating cavity is fixedly connected witha rotating motor; the lower end of the rotating motor is in power connection with a rotating shaft; the device has the advantages that the structure is simple, the operation is convenient and fast, the quality detection on the connection part between the semiconductor and the circuit board is automatically completed through mechanical transmission, in addition, the repair welding on the unqualified part is automatically completed after the unqualified part is detected, the product quality is ensured, the subsequent manual repair welding is avoided, and the efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a circuit board semiconductor solder spot detection device. Background technique [0002] At present, soldering is very popular in industrial production, and manual soldering iron welding is mainly used. Operators need to master the heating time, and there are also mechanical automatic welding; [0003] At present, in some teaching laboratories or factories that use manual soldering to solder semiconductors and circuit boards, when testing the quality of soldered circuit boards, most of them rely on manual inspection or directly connect the circuit boards to see if they can work normally, which is time-consuming and labor-intensive. And inefficient. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a circuit board semiconductor solder spot detection device, which overcomes the problems of low detection efficiency and impr...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a circuit board semiconductor solder joint detection equipment to overcome the problems of low detection efficiency, thereby improving the detection efficiency

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