Manufacturing method of highly integrated electronic frequency divider

Abstract

The invention relates to a method for manufacturing a highly integrated electronic frequency divider, comprising a highly integrated electronic frequency divider device comprising an encapsulation shell (1), a ceramic substrate arranged on the encapsulation shell (1) by bonding a substrate film (4) (6), the conductive adhesive (9) arranged on the ceramic substrate (6), the pulse distributor and the trigger chip (7) distributed on the ceramic substrate (6) through the conductive adhesive (9) and electrically connected to the A power supply (8) to be aged, a casing inner electrode (3) arranged in the encapsulating casing (1), a casing lead (2) arranged on the encapsulating casing (1) and electrically connected to the casing inner electrode (3), and a gold The wire (5); the gold wire (5) is used to electrically connect the pulse distributor and the trigger chip (7), the power supply to be aged (8), and the inner electrode (3) of the casing; the present invention has reasonable design, compact structure and convenient use .

Description

technical field [0001] The invention relates to a manufacturing method of a highly integrated electronic frequency divider. Background technique [0002] In recent years, with the continuous and rapid development of microelectronics technology, digital electronic technology has become more and more important in electronic equipment and daily industrial production, and its scope has become wider and wider. In particular, it has played a great role in the application and development of computer technology, and has had a profound impact on people's production and daily life. Digital electronic technology has become an important link in measuring the level of national industrial development. [0003] In digital electronic technology, the digital frequency division circuit has an important application. For a specific input frequency, the required output can be obtained after frequency division, which requires the circuit to have an integer multiple frequency division function. ...

AI Technical Summary

Problems solved by technology

The invention can highly integrate the pulse distributor, the trigger and the cooperating electronic devices using the thick-film circuit technology in the hybrid integrated circuit, so that they can be integrated into a device with only one package size of the pulse distributor, and realize fixed multi-frequency division function, which solves the technical problems that the current pulse distributor and trigger are not highly integrated, and the electronic devices used in conjunction with them occupy a large area, require a lot of work, and have low efficiency.

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