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Full-automatic semiconductor wafer glue spraying equipment

A semiconductor, fully automatic technology, applied in the direction of spraying devices, etc., can solve the problems of conveyor belt transmission obstruction, inconvenient gluing, small size of semiconductor wafers, etc., and achieve the effect of ensuring normal transportation

Active Publication Date: 2020-04-17
广西自贸区见炬科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of silicon elements, most of them are used to manufacture semiconductors. The semiconductor wafers are small in size and large in number, and gluing is extremely inconvenient. Therefore, semiconductor wafer gluing equipment has been developed to replace the disadvantages of low efficiency in manual gluing. , the current fully automatic semiconductor wafer glue spraying equipment has the following defects:
[0003] In order to make the semiconductor glue spraying more comprehensive, the existing fully automatic semiconductor glue spraying equipment sets the glue spray head as a spherical nozzle to realize complete gluing on the semiconductor wafer. The establishment of the spherical nozzle makes the spraying angle of the glue change. Wide, the excess glue sprayed in the working chamber and will stick to the inner wall of the working chamber after it dries, making the transmission of the conveyor belt hindered and jammed

Method used

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  • Full-automatic semiconductor wafer glue spraying equipment
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  • Full-automatic semiconductor wafer glue spraying equipment

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Embodiment 1

[0027] see Figure 1-Figure 8 , the present invention provides a fully automatic semiconductor wafer glue spraying equipment, the structure of which includes a housing 1, a spacer 2, a vent 3, a support column 4, and a conveyor belt 5, the housing 1 is provided with a spacer 2, the The spacer 2 cooperates with the conveyor belt 5, the conveyor belt 5 passes through the shell 1, the support column 4 is fixedly connected with the shell 1, the vent 3 is arranged on the side of the shell 1, and the vent 3 runs through the shell Body 1;

[0028] The spacer 2 is composed of a glue spray head a, a working chamber b, a processing table c, and an anti-splash mechanism d. The glue spray head a is installed in the working chamber b, and the glue spray head a is arranged on the top of the working chamber b On the inner wall, the glue spraying head a cooperates with the anti-splash mechanism d, and the anti-splash mechanism d is installed on the processing table c, and the processing tabl...

Embodiment 2

[0036] see figure 1 , Figure 5-Figure 8 , the present invention provides a fully automatic semiconductor wafer glue spraying equipment, the structure of which includes a housing 1, a spacer 2, a vent 3, a support column 4, and a conveyor belt 5, the housing 1 is provided with a spacer 2, the The spacer 2 cooperates with the conveyor belt 5, the conveyor belt 5 passes through the shell 1, the support column 4 is fixedly connected with the shell 1, the vent 3 is arranged on the side of the shell 1, and the vent 3 runs through the shell body 1; the spacer 2 is composed of a glue spray head a, a working chamber b, a processing table c, and an anti-splash mechanism d. The glue spray head a is installed in the working chamber b, and the glue spray head a is set On the inner wall of the top of the chamber b, the glue spray head a is matched with the splash prevention mechanism d, and the splash prevention mechanism d is installed on the processing table c, and the processing table...

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Abstract

The invention discloses full-automatic semiconductor wafer glue spraying equipment. The equipment structurally comprises a shell, a spacing device, a vent, a support column and a conveyor belt, wherein the spacing device is arranged in the shell, the support column is fixedly connected with the shell, and the vent is formed in the side surface of the shell and penetrates through the shell. The equipment has the beneficial effects that a screw rod is driven by an external mechanical force to rotate in situ clockwise or counterclockwise to realize the control over the lifting of a fixing block;when the fixing block moves upwards, a connecting rod is upwards along with the fixing block, and when the fixing block is embedded into a first groove in a processing table, the connecting rod pushesshielding covers to turn upwards around a fixing ball to close to cover a glue spraying head, so that spaced glue spraying is realized; when the two shielding covers move in the direction towards each other in a surrounding mode to close, the tops of the two shielding covers are hollow out, and the hollow-out caliber is just enough to cover the glue spraying head, so that glue spraying in a separate and spaced mode through the glue spraying head is realized, the problem that glue sprayed out through the glue spraying head is attached in a working cavity and then dried, and thus convey jammingof the conveyor belt is generated is avoided, and normal conveying of the conveyor belt is effectively ensured.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a fully automatic semiconductor wafer glue spraying equipment. Background technique [0002] With the development of silicon elements, most of them are used to manufacture semiconductors. The semiconductor wafers are small in size and large in number, and gluing is extremely inconvenient. Therefore, semiconductor wafer gluing equipment has been developed to replace the disadvantages of low efficiency in manual gluing. , the current fully automatic semiconductor wafer glue spraying equipment has the following defects: [0003] In order to make the semiconductor glue spraying more comprehensive, the existing fully automatic semiconductor glue spraying equipment sets the glue spray head as a spherical nozzle to realize complete gluing on the semiconductor wafer. The establishment of the spherical nozzle makes the spraying angle of the glue change. Widely, the excess glue will stick to...

Claims

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Application Information

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IPC IPC(8): B05B13/02B05B12/32
CPCB05B13/0221B05B13/0278B05B12/32
Inventor 邓筑蓉
Owner 广西自贸区见炬科技有限公司
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