A parallel seam welding package point frequency source component and its manufacturing method

A parallel seam welding and assembly technology, applied in circuit devices, electrical components, sealed enclosures, etc., can solve the problems of high production cost, long design cycle, and limitation of high-frequency characteristics.

Active Publication Date: 2021-07-06
THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when low-temperature co-fired ceramic (LTCC) technology is used for packaging, the design cycle is long and the production cost is high; although components made of PCB boards are in the microwave and millimeter wave bands, their high-frequency characteristics are limited

Method used

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  • A parallel seam welding package point frequency source component and its manufacturing method
  • A parallel seam welding package point frequency source component and its manufacturing method
  • A parallel seam welding package point frequency source component and its manufacturing method

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] A parallel seam welding package point frequency source assembly, such as figure 1 As shown, it includes a housing 1, a circuit board 2 and a package cover 3; the inner cavity of the housing 1 is provided with a pillar 14; Pin 12 is fixed;

[0035] Such as figure 2 As shown, the circuit board 2 is provided with a circuit lead-out hole 22 corresponding to the wire shell lead-out hole 11; a frequency source device is welded in the circuit of the circuit...

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Abstract

The invention relates to the field of radio electronic circuits, in particular to a parallel seam welding packaged point frequency source assembly, comprising: a casing, a circuit board and a packaging cover; a pillar is arranged in the inner cavity of the casing; a lead-out hole is arranged on the bottom surface of the inner cavity of the casing, and the The insulator fixes the guide pin passing through the lead-out hole of the wire; the circuit board is provided with a circuit lead-out hole corresponding to the lead-out hole of the wire shell; the circuit of the circuit board is welded with a bit frequency source device; Support the circuit board, and connect the pins and the circuit lead-out holes with solder; use the edge-exposed copper pad to fix the circuit board in the inner cavity of the shell; the package cover is the same size and shape as the shell, and cover the package cover on the shell groove On the mouth, it is packaged with solder; the invention can effectively protect the circuit board components by making a metal shell, improve the impact resistance, vibration resistance, salt spray resistance, and mold resistance of the components, and improve the environmental adaptability of the components.

Description

technical field [0001] The invention relates to the field of radio electronic circuits, in particular to a parallel seam welding packaged point frequency source assembly and a manufacturing method thereof. Background technique [0002] The frequency source is a very important part of the radio electronic system. It provides a stable frequency signal for the entire system. There are many types of frequency sources, and the point frequency source is one of them, which can provide frequency signals at one or more fixed frequency points. In order to meet the frequency point signal required by the system, most of the point frequency sources at home and abroad are synthetic point frequency sources. Commonly used frequency synthesis methods are divided into direct analog synthesis, direct digital synthesis, indirect analog synthesis, and indirect digital synthesis. The basic circuit principles are different, and the final component indicators are also different. [0003] There are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02H05K5/06H05K1/18H05K1/11H05K1/02H05K3/00H05K3/34
CPCH05K1/0218H05K1/0224H05K1/115H05K1/18H05K3/00H05K3/34H05K5/0217H05K5/0247H05K5/06H05K2201/0715
Inventor 曾铮成精折刘星张广涵禹和平王树升
Owner THE 44TH INST OF CHINA ELECTRONICS TECH GROUP CORP
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