Adjustable polishing device for machining of aluminum-based copper-clad plate

Abstract

The invention discloses an adjustable polishing device for machining of an aluminum-based copper-clad plate. The adjustable polishing device comprises a device main body, a fixed table, a fixed plateand a sliding plate. A moving groove matched with the fixed plate is formed in the top end of the fixed table, and a limiting plate is fixed to the position, in the moving groove, of the bottom end ofthe fixed plate. A spring is fixed between the limiting plate and the top end of the moving groove. A holding cavity is formed in the top end of the device main body. A slider matched with the holding cavity is fixed to the bottom end of the sliding plate, and a threaded rod penetrates through the slider. The threaded rod and the two side walls of the holding cavity are connected through bearings. The threaded rod drives the slider to move in the holding cavity, thus the distance between a polishing block and a copper plate is adjusted, the problem that the thickness and distance of existingpolishing equipment cannot be adjusted is solved, the application range of the equipment is widened, the problem that scraps are inconvenient to clean away during grinding polishing of the existing polishing equipment is solved, thus the polished scraps are easy and convenient to collect, and convenience of polishing operation is improved.

Description

technical field [0001] The invention relates to the technical field of polishing equipment, in particular to an adjustable polishing device for processing aluminum-based copper-clad laminates. Background technique [0002] The existing aluminum-based copper-clad laminate needs to be cut according to the actual size requirements during production. After the cutting is completed, some burrs may appear on the cut surface of some copper plates, which need to be polished. The existing polishing generally places the copper plate on the On the fixed table, move the grinding block to polish it. Since the thickness and width of the aluminum-based copper-clad laminate are different during production, the height and distance also need to be adjusted when it is fixed. The fixing mechanism of the existing polishing equipment generally does not have The adjustment mechanism of thickness and width reduces the scope of application of polishing equipment; [0003] When the existing polishin...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an adjustable polishing device for processing aluminum-based copper-clad laminates, so as to solve the problems that the existing polishing equipment fixed structure is inconvenient to adjust and debris management is relatively inconvenient in the above-mentioned background technology

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