A carrier plate for mass transfer, mass transfer device and method thereof

A technology of a transfer device and a transfer method, which is applied in the field of mass transfer and can solve the problems of small size and difficult adjustment of micro-device spacing.

Active Publication Date: 2021-11-02
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the spacing of micro-devices is usually adjusted according to needs. Due to the large number of micro-devices and small size, there is a problem that the spacing of micro-devices is difficult to adjust

Method used

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  • A carrier plate for mass transfer, mass transfer device and method thereof
  • A carrier plate for mass transfer, mass transfer device and method thereof
  • A carrier plate for mass transfer, mass transfer device and method thereof

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Embodiment Construction

[0036] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Please also see Figure 1-Figure 6 , the present invention provides some embodiments of a mass transfer carrier.

[0038] like figure 1 As shown, a carrier plate 10 for mass transfer of the present invention includes: a temperature control device 11, a telescopic plate 12 located on the temperature control device 11, and a first adhesive layer 13 disposed on the telescopic plate 12 The temperature control device 11 is used to control the temperature of the telescopic plate 12, and the telescopic plate 12 is used to expand and contract according to temperature changes, so as to a...

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Abstract

The invention discloses a carrier plate for mass transfer, a mass transfer device and a method thereof. The carrier plate for mass transfer includes: a temperature control device, a telescopic plate located on the temperature control device, and a The first viscous layer on the stretchable plate; the temperature control device is used to control the temperature of the stretchable plate, and the stretchable plate is used to expand and contract according to temperature changes, so as to adjust the adhered micro devices on the first viscous layer Pitch. In the mass transfer process, the micro-devices are glued to the telescopic board through the first adhesive layer. If the distance between the micro-devices needs to be adjusted, the temperature of the telescopic board can be adjusted through the temperature control device. The telescopic board will be affected by the temperature change. Stretching or shrinking, thereby driving the increase or decrease of the spacing of the micro-devices adhered to the telescopic plate, so that the spacing of the micro-devices is adjusted in the further mass transfer process.

Description

technical field [0001] The invention relates to the technical field of mass transfer, in particular to a carrier plate for mass transfer, a mass transfer device and a method thereof. Background technique [0002] Micro-device technology refers to an array of micro-sized components integrated at high density on a driver circuit board. At present, micro-pitch light-emitting diode (Micro-LED) technology has gradually become a research hotspot. Micro-LED technology, that is, LED miniaturization and matrix technology, has good stability, lifespan, and advantages in operating temperature. It also inherits the LED has the advantages of low power consumption, color saturation, fast response, strong contrast, etc. Micro-LED has higher brightness and lower power consumption. [0003] In the prior art, the pitch of the micro-device is usually adjusted according to the needs. Due to the large number and small size of the micro-device, it is difficult to adjust the pitch of the micro-de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/677
CPCH01L21/67706H01L21/6773H01L21/67736H01L21/6835H01L2221/68368H01L2221/68381
Inventor 钟光韦伍凯义杨然翔江仁杰沈佳辉
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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