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A kind of automatic system and method for pcb solder resist spraying

An automated system, PCB board technology, applied in the direction of copying/marking methods, typewriters, printing, etc., can solve the problems of wasting time, scrapping, spraying ink too thin, etc.

Active Publication Date: 2021-12-21
GUANGZHOU FASTPRINT CIRCUIT TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the actual spraying production process, there are always PCBs with multiple copper thickness specifications. When adjusting the wet film thickness of different inks, it is necessary to adjust the parameters of the spraying machine many times to obtain the desired ink wet film thickness.
This process is not only a waste of time, but also may cause the spraying ink to be too thin and the circuit to be exposed to copper due to human error in the process.

Method used

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  • A kind of automatic system and method for pcb solder resist spraying

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Embodiment 1

[0024] refer to figure 1 , shows a schematic structural diagram of the PCB solder resist spraying automation system in this embodiment. The system is used for an information collection module for collecting incoming PCB information, a feeding device for conveying PCB boards, a main controller and a spraying module for spraying ink. Wherein, the output end of the information collection module is connected with the input end of the main controller, and the output end of the main controller is connected with the input end of the spraying module.

[0025] In this embodiment, the information collection module includes devices such as a camera or a scanning gun that can collect PCB information.

[0026] Furthermore, the above system also includes an information acquisition module for pre-acquiring PCB board production attribute parameters, the output end of the information acquisition module is connected to the input end of the main controller.

[0027] In this embodiment, the mai...

Embodiment 2

[0037] This embodiment provides an automatic method for PCB solder resist spraying, the method comprising:

[0038] Collect PCB board information;

[0039] Control the ink spraying on the PCB board according to the PCB board information.

[0040] Furthermore, the method also includes:

[0041] Real-time control of ink supply according to ink pressure.

[0042] In this embodiment, first collect the PCB incoming board information, identify the production attribute parameters of the PCB incoming board according to the PCB incoming board information, and then process the PCB board according to the pre-stored PCB production attribute parameters and corresponding spraying process parameters. Automated ink dispensing. During the spraying process, the ink barrel pressure and spray gun pressure are also fed back in real time, and the ink barrel and spray gun are adjusted in real time according to the ink barrel pressure and spray gun pressure to control the ink supply.

[0043] For...

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PUM

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Abstract

The invention discloses an automatic system and method for PCB solder resist spraying, and relates to the field of PCB production. The system includes an information collection module for collecting PCB board information, a feeding device for conveying PCB boards, a main controller and a spraying module for spraying ink, and the output of the information collection module is connected to the main controller. The input end is connected, and the output end of the main controller is connected with the input end of the spraying module. The invention can automatically collect PCB incoming board information, identify PCB production attribute parameters, and perform automatic spraying according to PCB production attribute parameters. Compared with the existing solder resist spraying production methods, it has the advantages of accuracy, high efficiency and timeliness. It can ensure that the equipment can run accurately even when no one is on duty.

Description

technical field [0001] The invention relates to the field of PCB production, in particular to an automatic system and method for spraying PCB solder resist. Background technique [0002] When printing circuit boards, a layer of ink is often applied to the surface of the PCB, and after curing, it can protect against moisture, insulation, and soldering. At present, spraying machines are generally used in the industry to spray and cure solder resist ink on PCB boards. The coating thickness and uniformity of solder resist ink are very important. Due to the fluidity of the liquid ink itself, there will be a vertical flow effect when it is sprayed on the PCB conductor circuit, which will affect the coverage effect of the circuit conductor. Therefore, the thicker the copper thickness of the line conductor, the thicker the ink wet film thickness that needs to be sprayed. [0003] However, in the actual spraying production process, there are always PCBs with multiple copper thickne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J3/407B41M5/00
CPCB41J3/407B41M5/0047
Inventor 邓亚峰陈黎阳彭文才
Owner GUANGZHOU FASTPRINT CIRCUIT TECH