Optical transmission equipment

Abstract

The application provides optical transmission equipment comprising at least one optical module cage unit fixedly arranged on a service circuit board. The optical module cage unit comprises one or morefirst optical module cages arranged on the upper layer and one or more second optical module cages arranged on the lower layer. Each first optical module cage is used for placing one or more first optical modules, and each second optical module cage is used for placing a second optical module; the first optical module is used for service side optical communication connection, and the second optical module is used for client side optical communication connection. Welding pins of the first optical module cage and the second optical module cage are staggered and do not interfere with each other.The optical module cages on the service side and the sending side are stacked and do not interfere with each other, so that more spare space in the equipment is provided for configuring more opticalmodules and thus the interface density is improved; and heat dissipation of the first optical module on the service side with relatively high power consumption is facilitated.

Description

technical field [0001] The present application relates to the technical field of optical transmission network, in particular to optical transmission equipment. Background technique [0002] At present, the common optical transmission equipment supporting CFP2 includes the blade plug-in type of large chassis and the standard 1U chassis type. [0003] Blade plug-in card type in a large chassis: The whole machine is large and has complete functions. Although it can support different business communication functions, the disadvantage is that the height of this kind of equipment is above 12U (540mm), and the power consumption of the equipment is 2000 watts. above. This kind of equipment is suitable for use in a large-scale overall project plan, which requires sufficient planning for the cabinet space and power distribution and energy consumption of the entire project. However, in the general single business demand, it will cause necessary cost increases. In addition, it cannot ...

AI Technical Summary

Problems solved by technology

Therefore, simply superimposing the interface density will face a huge challenge of heat dissipation, so the 1U devices in the market either have a small interface density, or have restrictions on the type of CFP2 modules (high power consumption CFP2 modules cannot be used)

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