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A focusing and leveling device, a lithography machine, and a focusing and leveling method

A technology of focusing and leveling device and light spot, which is applied in the field of lithography and can solve the problems of long adjustment time and low work efficiency.

Active Publication Date: 2021-09-10
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a focusing and leveling device, a lithography machine and a method for focusing and leveling, so as to solve the problems of long adjustment time, The problem of low work efficiency and the need for repeated operations

Method used

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  • A focusing and leveling device, a lithography machine, and a focusing and leveling method
  • A focusing and leveling device, a lithography machine, and a focusing and leveling method
  • A focusing and leveling device, a lithography machine, and a focusing and leveling method

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Embodiment 1

[0051] figure 1 , is a schematic structural diagram of a focusing and leveling device provided in Embodiment 1 of the present invention, please refer to figure 1 , the present invention provides a focusing and leveling device, including a main control unit 15 and a drive unit, the main control unit 15 is used to obtain adjustment parameters according to the vertical position of the surface of the silicon wafer 34 and the coordinate position results of the measurement spot , and control the drive unit to automatically adjust the focusing and leveling device according to the adjustment parameters, so that the variation of the vertical position of the surface of the silicon wafer 34 is equal to 0, the adjustment parameters include the incident angle parameter, full field magnification parameter, full field rotation parameter and eccentricity parameter. Therefore, the alignment of the projection mark and the detection mark of the focusing and leveling device is realized, the adju...

Embodiment 2

[0083] The present invention also provides a photolithography machine, including the above-mentioned focusing and leveling device, which realizes the alignment of the projection mark and the detection mark of the focusing and leveling device, greatly reduces the adjustment time, and thus improves the work efficiency .

Embodiment 3

[0085] The present invention also provides a method for focusing and leveling, comprising the following steps:

[0086] S1: measurement step, the image acquisition and processing unit 14 modulates each detection mark, calculates the vertical position of the silicon wafer surface, and measures the focus of each detection mark corresponding to the measurement spot on the silicon wafer 34 Coordinates in the coordinate system of the leveling device.

[0087] S2: Analyzing step, through the image acquisition and processing unit 14, the elements of the measurement spot corresponding to each of the detection marks are decomposed into: an incident angle element 45, an entire field rotation element 47, an entire field magnification element 46, and an eccentric element 48 and image distortion elements.

[0088] image 3 , is a schematic diagram of the triangulation method, please refer to image 3 , the photoelectric focusing and leveling device is measured by triangulation, the rela...

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Abstract

The present invention provides a focusing and leveling device, a lithography machine and a focusing and leveling method. The focusing and leveling device includes a main control unit and a drive unit. The main control unit is used to The vertical position of the measuring spot and the coordinate position of the measurement spot are obtained as adjustment parameters, and the drive unit is controlled to automatically adjust the focusing and leveling device according to the adjustment parameters, so that the vertical position of the surface of the substrate The amount of change is equal to 0, and the adjustment parameters include incident angle parameters, full-field magnification parameters, full-field rotation parameters, and eccentric parameters. Therefore, the alignment of the projection mark and the detection mark of the focusing and leveling device is realized, the adjustment time is greatly reduced, and thus the working efficiency is improved.

Description

technical field [0001] The invention belongs to the field of photolithography, and relates to a focusing and leveling device, a photolithography machine and a focusing and leveling method. Background technique [0002] As a key subsystem of the lithography machine, the focus and leveling system (FLS) mainly measures the vertical height information and tilt information of the silicon wafer surface to ensure that the silicon wafer is at the best focal plane position of the objective lens during the exposure process. Most of the sensors used to measure the vertical position of silicon wafers use photoelectric measurement methods. [0003] In order to accurately align the projection mark and the detection mark, the offline manual method is usually used at present. This adjustment method relies too much on the experience and luck of the lithography machine assembly engineer, and the adjustment time is long, the efficiency is low, and multiple repeated operations are required, red...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F9/00
CPCG03F7/70258G03F7/7085G03F9/7026G03F9/7034
Inventor 季桂林
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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