Automatic PIN feeding, discharging and punching mechanism for grinding machine

Abstract

The invention discloses an automatic PIN feeding, discharging and punching mechanism for a grinding machine. The automatic PIN feeding, discharging and punching mechanism comprises a PIN storage assembly used for storing and providing PINs, wherein one side of the PIN storage assembly is connected with a PIN feeding assembly matched with the PIN storage assembly, the other side of the PIN storageassembly is connected with a driving assembly, and a rotating assembly is installed on the back face of the driving assembly; and the driving assembly converts the horizontally-arranged PINs into vertically-arranged PINs, and enables the PINs to correspond to inner holes of welding pins needing to be machined. According to the automatic PIN feeding, discharging and punching mechanism for the grinding machine, the PIN storage assembly is arranged, so that the PINs are stored in batches, rapid and automatic feeding is facilitated, and automation is easy to achieve; furthermore, the pushing process of the PINs is continuously completed through an ejector rod and multiple guide grooves, and automatic feeding and discharging of the PINs are completed in cooperation with the driving assembly, sothat the machining space is saved; in addition, the PINs can be quickly and accurately positioned through a guide plate and an air blowing pipe during feeding; and finally, feeding and discharging routes of the PINs are fixed and controllable through a limiting block, a limiting device and the guide grooves, and the production process is stable and efficient.

Description

technical field [0001] The invention relates to the technical field of grinding machines, in particular to an automatic loading and unloading and hole-feeding mechanism with PIN needles for grinding machines. Background technique [0002] The diameter and angle of the inner chamfer (IC, Inside Chamfer) of the solder pin directly affect the size and shape of the solder joint when the semiconductor chip is packaged. As a key tool for chamfering the inner hole of the solder pin, the PIN pin is pre-ground on the grinding machine for the angle and diameter according to the needs of solder pin processing. During automatic IC processing, on average, 2 to 3 PIN pins are used for processing one solder pin, so the speed and accuracy of the automatic loading and unloading of PIN pins and automatic hole entry will directly affect the efficiency and accuracy of IC processing. In the field of semiconductor solder pin processing, the traditional technology is manual loading and unloading ...

AI Technical Summary

Problems solved by technology

In the field of semiconductor solder pin processing, the traditional technology is manual loading and unloading of PIN pins. With the aid of a microscope, the tip of the PIN pin enters the hole of about 30 μm on the solder pin, which requires a high degree of proficiency of the operator and low efficiency. Labor costs remain high

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