Multi-field-assisted diamond cutting equipment

Abstract

The invention belongs to the technical field relevant to ultra-precision machining, and discloses multi-field-assisted diamond cutting equipment. The diamond cutting equipment comprises a laser auxiliary device, an ultrasonic vibration auxiliary device, a magnetic field auxiliary device and a machining auxiliary device, and the magnetic field auxiliary device and the ultrasonic vibration auxiliarydevice are arranged on the machining auxiliary device and oppositely arranged; the laser auxiliary device and the ultrasonic vibration auxiliary device are oppositely arranged; the machining auxiliary device is further used for bearing workpieces; in the machining process, the magnetic field auxiliary device generates a magnetic field, and the workpieces are located in the magnetic field; and thelaser auxiliary device emits a laser beam so as to conduct preheating softening or degrading on the workpieces, the ultrasonic vibration auxiliary device generates two-dimensional elliptic vibrationat a tool nose of a diamond cutting tool, and meanwhile the laser beam is focused on the tool nose of the diamond cutting tool. The machining efficiency and quality are improved, the life of the cutting tool is prolonged, and flexibility is good.

Description

technical field [0001] The invention belongs to the technical field related to ultra-precision machining, and more specifically relates to a multi-field assisted diamond cutting equipment. Background technique [0002] At present, difficult-to-process hard and brittle materials (such as semiconductor materials, optical crystal materials, etc.) have been widely used for their excellent mechanical properties, optical properties, physical properties and chemical properties. The chemical resistance, biocompatibility and fracture resistance of titanium alloys are widely used in the field of aerospace detection, especially aero engines, but the difficult-to-machine characteristics of titanium alloys make it difficult to process aerospace detection components with high surface quality. [0003] Ultrasonic vibration-assisted cutting technology is an intermittent cutting method, which can achieve nano-scale material removal in each vibration cycle, effectively enhance tool cooling an...

AI Technical Summary

Problems solved by technology

Ultrasonic vibration-assisted, laser-assisted and magnetic field-assisted processing technologies are effective methods for processing hard and brittle materials and titanium alloys. However, due to intermittent cutting, ultrasonic vibration-assisted processing requires small amplitudes, resulting in low processing efficiency. The microscopic impact causes the tool to produce chipping damage; on the other hand, in laser-assisted processing, the large laser power is easy to cause sub-surface damage on the surface of the workpiece

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