White-light LED chip and preparation method thereof
An LED chip, white light technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of not being able to intuitively identify chip electrodes, etc., and achieve the effect of improving brightness, improving spot uniformity and luminous brightness, and improving flatness
Inactive Publication Date: 2020-05-01
JIANGXI LATTICEBRIGHT
View PDF11 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] In order to overcome the above disadvantages, the present invention provides a white light LED chip and its preparation method, which effectively solves the technical problem that the surface of the existing white light LED chip cannot visually identify the chip electrodes
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] In order to more clearly illustrate the implementation cases of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.
[0022] Such as Figure 1~5 Shown is a schematic flow chart of an embodiment of the preparation method of the white LED chip 2 provided by the present invention. As shown in the figure, the preparation method includes:
[0023] S10 Arrange the flip-chip LED chips 2 on the surface of the first support film 1 according to rules, and the light-emitting side surface of the LED chips 2 faces upward, as figure 1 shown. Specifically, the shape and spacing of the arrangement of ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a white-light LED chip and a preparation method thereof. The preparation method comprises the steps of: S10, enabling inverted LED chips to be regularly arranged on the surfaceof a first supporting film, and enabling the light-emitting side surfaces of the LED chips to face upwards, S20, sequentially attaching the fluorescent film sheets cut into the preset size to the surfaces of the LED chips to cover the light-emitting surfaces of the LED chips, S30, filling high-reflection white glue between the LED chips until the high-reflection white glue is flush with the heightof the fluorescent film sheet, S40, marking an electrode of the LED chip on the high-reflection white glue on the side edge of the fluorescent film sheet, and S50, cutting the cutting channel betweenthe LED chips and removing the first supporting film to obtain a single white-light LED chip with an electrode mark. The technical problem that a chip electrode cannot be visually identified on the surface of an existing white light LED chip is effectively solved.
Description
technical field [0001] The invention relates to the technical field of LEDs, in particular to a white LED chip and a preparation method thereof. Background technique [0002] In the packaging factory, in order to obtain a better light spot, there are more and more application forms of packaging the sapphire chip into a single-sided light output. Specifically, the purpose is achieved by surrounding the flip-chip sapphire chip with high-reflective white glue. However, currently there is a problem in packaging the flip-chip sapphire chip into single-sided light emission: the fluorescent film will cover the entire chip surface, blocking the electrode identification, and the electrodes of the chip cannot be identified from the chip surface. Contents of the invention [0003] In order to overcome the above disadvantages, the present invention provides a white light LED chip and a preparation method thereof, which effectively solves the technical problem that the chip electrodes ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/60H01L33/56H01L33/50H01L33/36
CPCH01L33/60H01L33/501H01L33/502H01L33/56H01L33/36H01L2933/0041H01L2933/005H01L2933/0058H01L2933/0016
Inventor 江柳杨
Owner JIANGXI LATTICEBRIGHT