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Electronic equipment, circuit board and preparation method thereof

A circuit board and circuit technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of low yield rate and decreased yield rate of finished products, and achieve the effect of avoiding structural changes and internal short circuits

Active Publication Date: 2020-05-01
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the yield rate of high-end PCBs such as HDI boards of any order is very low, which is mainly limited by the existing manufacturing process. Each additional order of laser drilling requires one more pressing, and the expansion and contraction caused by pressing will reduce the yield of the finished product. decline

Method used

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  • Electronic equipment, circuit board and preparation method thereof
  • Electronic equipment, circuit board and preparation method thereof
  • Electronic equipment, circuit board and preparation method thereof

Examples

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Embodiment Construction

[0072] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure.

[0073] In the drawings, the thicknesses of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0074] The described features, structures, or characteristic...

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PUM

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Abstract

The invention provides electronic equipment, a circuit board and a preparation method thereof and belongs to the technical field of the circuit board. The preparation method of the circuit board comprises steps that a substrate is provided; a first layer of circuit is formed on one side of the substrate; first circuit stacking operation to N circuit stacking operation are sequentially executed, wherein the n circuit stacking operation comprises steps that an n dielectric layer is formed on the side, away from the substrate, of the n circuit, and the n dielectric layer is provided with at least one n through hole exposing the n circuit; an (n+1)th layer of circuit is formed on one side, far away from the substrate, of an n layer of dielectric layer, wherein the(n+1) layer of circuit is electrically connected with the n layer of circuit through the n layer of through hole; the N is a positive integer greater than 1; wherein 1 <= n <= N, and n is an integer. The preparation method of the circuit board can improve the yield of the circuit board.

Description

technical field [0001] The present disclosure relates to the technical field of circuit boards, in particular to an electronic device, a circuit board and a preparation method thereof. Background technique [0002] PCB (Printed Circuit Board, printed circuit board) is usually made of pressed copper clad laminates, and is the carrier and connector of many electronic devices. HDI (High Density Interconnector, High Density Interconnect) PCBs have developed rapidly driven by the demand for short, light and thin PCBs, the improvement of chip integration, the increase in the number of pins, and the introduction of advanced packaging. The HDI board replaces the through holes of the traditional PCB with laser drilling, and is equipped with a higher-precision exposure machine to achieve a substantial increase in routing density. [0003] However, the yield rate of high-end PCBs such as HDI boards of any order is very low, which is mainly limited by the existing manufacturing process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/11
CPCH05K3/465H05K3/4644H05K1/115H05K3/467H05K1/056H05K3/4038
Inventor 庞凤春李月曹雪
Owner BOE TECH GRP CO LTD