A sealing structure and a tr module adopting the sealing structure

Abstract

The present invention relates to the field of packaging and sealing of electronic products, in particular to a sealing mechanism and a TR module adopting the sealing structure. The sealing structure includes a sealing part 1 and a sealing part 2 which are buckled and connected, and the sealing part 1 can be sleeved on The external connector of the circuit board also includes a sealing part three, the sealing part two is provided with a connecting part one, and the sealing part three is provided with a connecting part two snap-fitted with the connecting part one, so The third seal can be bent to fit the shape of the airtight cavity, the first seal, the second seal and the third seal are all arranged between the sealing surfaces of the airtight cavity, and the first seal and the second seal between the seals 2 and 3 to form a wave mating surface, to realize the sealing of the external connector area of ​​the circuit board and the surrounding area around the circuit board. The TR module adopts the above-mentioned sealing structure, and the sealing effect is relatively good. Well, it guarantees the long-term normal use of the wave control sub-board packaged in the TR module.

Description

technical field [0001] The invention relates to the field of packaging and sealing of electronic products, in particular to a sealing mechanism and a TR module adopting the sealing structure. Background technique [0002] In the field of electronic packaging, it is often necessary to hermetically seal the circuit board. For circuit boards with high airtightness requirements, the overall laser sealing and welding of the package shell is required. For example, the RF device of the TR module, the wave controller packaged in it The airtightness requirements of the board are very high. Generally, laser sealing and welding are used to fasten the edge of the packaging shell to maintain airtightness. However, due to the external interconnection connectors on the wave control sub-board, it is limited by the structural design of the packaging shell. , good airtightness cannot be achieved at the connector position, resulting in the failure of the wave control sub-board and its internal...

AI Technical Summary

Problems solved by technology

[0002] In the field of electronic packaging, it is often necessary to hermetically seal the circuit board. For circuit boards with high airtightness requirements, the overall laser sealing and welding of the package shell is required. For example, the RF device of the TR module, the wave controller packaged in it The airtightness requirements of the board are very high. Generally, laser sealing and welding are used to fasten the edge of the packaging shell to maintain airtightness. However, due to the external interconnection connectors on the wave control sub-board, it is limited by the structural design of the packaging shell. , good airtightness cannot be achieved at the connector position, resulting in the failure of the wave control sub-board and its internal components to form a sealed structure. Condensation of water vapor, entry of dust and other foreign matter will lead to contamination of the internal components of the wave control sub-board, performance degradation, and even more serious consequences

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