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Laser machining method, laser machining device, laser machining equipment and storage medium

A laser processing method and laser processing technology, applied in metal processing equipment, laser welding equipment, welding equipment, etc., can solve the problems of cumbersome operation, unusability, and low efficiency

Active Publication Date: 2020-05-08
深圳市大族半导体装备科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing technology has cumbersome operation, low efficiency, and cannot be used in applications where continuous laser processing is necessary

Method used

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  • Laser machining method, laser machining device, laser machining equipment and storage medium
  • Laser machining method, laser machining device, laser machining equipment and storage medium
  • Laser machining method, laser machining device, laser machining equipment and storage medium

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Embodiment Construction

[0050] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the application more thorough and comprehensive.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application.

[0052] Some embodiments of the present application disclose a ...

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Abstract

The invention belongs to the technical field of laser machining, and relates to a laser machining method, a laser machining device, laser machining equipment and a storage medium. The laser machiningmethod includes the steps that an A axis and a B axis of a galvanometer scanning system are linked with an X axis and a Y axis of a cross motion platform to achieve a planned machining trajectory; when the cross motion platform drives a workpiece to move, feedback signals of the A axis and the B axis of the galvanometer scanning system and feedback signals of the X axis and the Y axis of the crossmotion platform are acquired; the pulse number of the feedback signals of the A axis and the B axis and the pulse number of the feedback signals of the X axis and the Y axis are subjected to conversion; when the movement distance of the workpiece on the X axis generates a difference nabla x, the A axis conducts compensatory movement by nabla x; and when the movement distance of the workpiece on the Y axis generates a difference nabla y, the B axis conducts compensatory movement by nabla y. The laser machining method can ensure that the workpiece of the cross motion platform is in an optimal machining area at the center of a machining range of the galvanometer scanning system.

Description

technical field [0001] The application belongs to the technical field of laser processing, and relates to a laser processing method, a laser processing device, a laser processing device and a storage medium. Background technique [0002] At present, many laser processing equipment will use the galvanometer scanning system. Due to the limitation of the working principle of the galvanometer scanning system, there will be an inclination angle between the laser light and the processing surface and an increase in spot distortion at a position far away from the center of the processing range, and the interpolation distance between positioning points will increase, and the positioning accuracy will decrease. Bad question. In the prior art, in applications requiring high machining accuracy, only a small area near the center of the machining range of the galvanometer scanning system can be used, that is, the optimal machining area. [0003] In the process of studying this applicati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/082B23K26/70
CPCB23K26/082B23K26/702
Inventor 颜传祥周志伟陈才伟马国东尹建刚吴林龙洪熔胡雄雄朱洪涛黄政高云峰
Owner 深圳市大族半导体装备科技有限公司