Flexible interconnection movable lead of columnar lead and substrate of microwave device

Abstract

The invention discloses a flexible interconnection movable lead of a columnar lead and a substrate of a microwave device. The flexible interconnection movable lead comprises a jack structure and a metal lead, one end of the metal lead is connected with the jack structure, and the other end of the metal lead is welded with the substrate; the jack structure is electrically connected with the columnar lead on the microwave device through a plugging structure; the inserting structure is of a four-claw structure, and a mounting hole is formed in the center of the inserting structure; the mounting hole is matched with a columnar lead on the microwave device in size; and the microwave device and the substrate are both installed on the aluminum casing. According to the invention, the requirement of interconnection of the movable lead and the device lead in the aspect of stress release under the environmental test condition can be met, the advantage of hard lap welding interconnection in the aspect of signal transmission is also realized, the signal transmission stability can be ensured, the product repair rework rate is reduced, and the production efficiency is remarkably improved.

Description

technical field [0001] The invention relates to a movable lead for flexible interconnection between a columnar lead of a microwave device and a substrate, and belongs to the technical field of electronic assembly. Background technique [0002] Microwave devices are an important part of microwave active electronic products. With the continuous expansion of user demands, the demand for satellite equipment continues to increase, satellite functions are becoming more and more complex, and the capacity is increasing. Demand continues to rise. [0003] In microwave active products, microwave devices realize their functions by interconnecting lead wires with adjacent substrates. The application environment is complex. The assembly process of microwave devices, such as interconnection methods, interconnection materials, and solder joint size, can all affect microwave signal transmission, thereby affecting The performance stability and consistency of microwave devices in the space ...

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Problems solved by technology

[0006] 2) Copper strip interconnection has many influences and restrictions on microwave signal transmission, and copper strip is only suitable for strip-shaped device lead structures. At the same time, with the development of product miniaturization, the operating space is gradually reduced, which in turn poses greater restrictions on welding operations

[0007] 3) The rework processing of gold ribbon interconnection is far more troublesome than the rework processing of tin-lead soldering. It can only be implemented after the cover plate, device and other components are removed. The process is cumbersome and time-consuming.

At the same time, the reliability of the solder joint after rework needs to be further verified. The general treatment method is to directly replace the device

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