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Wafer movement monitoring method and gluing developer

A technology of glue developing and mobile monitoring, applied in the direction of coating equipment, electrical components, circuits, etc. in the photoengraving process, which can solve the problems of easy scratches in the transfer unit of wafers in and out, so as to improve the yield of wafers and avoid wafers. Scratches, the effect of reducing scratches

Inactive Publication Date: 2020-05-12
HUA HONG SEMICON WUXI LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0005] This application provides a method for monitoring wafer movement and a glue developing machine, which can solve the problem of easy scratches of wafers in and out of the transfer unit in the related art

Method used

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  • Wafer movement monitoring method and gluing developer
  • Wafer movement monitoring method and gluing developer
  • Wafer movement monitoring method and gluing developer

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Embodiment Construction

[0028] The technical solutions in this application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0029] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific orientati...

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PUM

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Abstract

The invention discloses a wafer movement monitoring method and a gluing developer, and relates to the field of semiconductor manufacturing. The wafer movement monitoring method is applied to a gluingand developing machine table, and a distance sensor is arranged at the front end of a shielding cover of a transfer unit in the gluing and developing machine table. The method comprises the steps thatthe gap distance between the wafer and the shielding cover in a transfer unit is detected through a distance sensor, and the wafer enters and exits the transfer unit through a mechanical arm; and thegap distance is displayed through the gluing and developing machine table. The problems that the gap distance between a wafer entering and exiting a transfer unit and a shielding cover cannot be monitored in real time and the wafer is easy to scratch at present are solved. The effects of monitoring the gap distance between the wafer and the shielding cover in real time and preventing the wafer from being scratched due to deviation of the mechanical arm are achieved.

Description

technical field [0001] The present application relates to the field of semiconductor manufacturing, in particular to a wafer movement monitoring method and a glue developing machine. Background technique [0002] Integrated circuit engineering includes integrated circuit design, fabrication and packaging. Processes involved in the manufacture of integrated circuits include photolithography, etching, deposition, thin film, CMP (chemical mechanical polishing, chemical mechanical planarization), etc., among which photolithography is the most critical step in the manufacture of integrated circuits. [0003] In the photolithography process, it is necessary to apply glue on the wafer, then use a mask to expose, transfer the target pattern to the glue-coated wafer, and then leave the visible pattern on the wafer surface through development. The equipment used in the photolithography process includes a glue developing machine (Track machine) and an exposure machine. [0004] There...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67G03F7/16
CPCH01L21/67259H01L21/67253G03F7/16
Inventor 王绪根吴长明姚振海陈骆闻旭
Owner HUA HONG SEMICON WUXI LTD
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