Non-taper laser cutting method

A laser cutting, no taper technology, used in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as taper problems, and achieve the effect of avoiding light blocking, no taper cutting, and increasing the range

Active Publication Date: 2020-05-15
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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Problems solved by technology

[0006] The purpose of the present invention is to mainly solve the problem of taper produced in the process of laser processing, and to provide a taper-free laser cutting method

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Embodiment Construction

[0029] Below in conjunction with accompanying drawing and specific embodiment the content of the present invention is described in further detail:

[0030] At present, ultra-fast lasers mainly use galvanometer processing to cut materials, but the galvanometer line scanning cutting method cannot solve the problem of cutting taper at one time. Aiming at the problems of damage and taper in the cutting process of airgel and other thermal structural materials with high requirements on damage and size, the invention provides a method for realizing low damage and no taper cutting by using a vibrating mirror.

[0031] Such as figure 1 As shown, the present invention adopts the existing laser processing system, which includes a laser, a beam expander, two mirrors, a vibrating mirror system and a field mirror arranged in sequence along the optical path. The femtosecond infrared laser with a wavelength of 1030nm is selected as the laser, and the telecentric field mirror with a focal len...

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Abstract

The invention relates to a non-taper laser cutting method. The taper problem generated during laser processing is solved. The non-taper laser cutting method includes the steps that (1) a kerf is cut into K segments in the height direction of the kerf; (2) the first segment of the kerf is divided into P layers in the height direction, and is sequentially scanned from the first layer to the last layer by laser; the cut surface of the kerf of a cut material is an A side and a B side correspondingly, the laser-scanning of each layer starts from the A side until a left filling surface of the layeris scanned, and then the laser-scanning starts again from the B side until a right filling surface of the layer is scanned; the left filling surface of each layer extends to the B side based on the Aside, the right filling surface of each layer extends to the A side based on the B side, the size of the left filling surface of the first layer to the last layer decreases in sequence, and the size of the right filling surface of the first layer to the last layer decreases in sequence; and (3) laser feeding is carried out, by referring to the step (2), the second segment of the kerf is cut untilcutting of the K segments of the kerf is completed.

Description

technical field [0001] The invention relates to an ultrafast laser processing technology, in particular to a taper-free laser cutting method. Background technique [0002] Airgel materials are mainly used in high-temperature service environments such as aviation and aerospace, and their thermal insulation and structural integrity during use often directly affect the service life of the entire system. Therefore, in the processing and preparation of airgel materials It also has quite strict technical requirements. [0003] The traditional processing methods of airgel materials are mechanical processing, high-pressure water jet processing and long pulse laser processing. However, this kind of processing method is easy to cause burrs, delamination, tearing, chipping, hot melting and other damage on the surface of airgel materials. At the same time, for structural parts with high size requirements, there are often serious tapers after cutting with the above method Problems, it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/14
CPCB23K26/38B23K26/402B23K26/14
Inventor 朱文宇王宁麻丁龙田东坡王三龙
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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