Wafer Inversion Integrated LED Display Packaging Module

Abstract

The invention relates to an integrated LED displaying packaging module with LED chips arranged in wafers in an inverted mode. The integrated LED displaying packaging module comprises a drive circuit board and the LED wafers. The LED wafers are fixed to the drive circuit board. The LED chips of at least one primary color in the LED wafers are arranged in the inverted mode, positive electrodes of the LED chips and a positive electrode printed on the drive circuit board are fixed together in a bonding mode through conductive silver adhesives, and negative electrodes of the LED chips and a negative electrode printed on the drive circuit board are fixed together in a bonding mode through conductive silver adhesives. Transparent substrates are adopted for the LED chips arranged in the inverted mode. Most trivial welding processes are omitted, production time and cost are reduced, the phenomenon that light is shielded by electrodes under forward situations is avoided, and light emitting efficiency is improved. Because the electrodes of the chips are connected with the drive circuit board through the conductive silver adhesives, the defect that a connecting wire is long in guide passage and too small in cross section area is overcome, heat dissipation is accelerated, and structural mechanical strength is also improved.

Description

technical field [0001] The invention belongs to the technical field of LED flat panel display, and relates to an integrated LED display packaging module with wafer upside-down installation. Background technique [0002] The integrated LED display module includes an LED display module composed of a driver IC, a driver circuit board, and red, green, and blue primary color LED wafers. The current common practice is: solder the driver IC on the back of the driver circuit board, place the LED chip upright and fix it on the corresponding pixel position on the front surface of the driver circuit board through an adhesive, and then connect the blue and green LED chips by wire bonding. The positive and negative electrodes and the positive electrode of the red LED crystal unit (single electrode) are connected to the corresponding circuit position of the circuit board by welding the connecting wire (gold wire or aluminum wire), and finally sealant and mask protection are carried out on...

AI Technical Summary

Problems solved by technology

[0003] In the above structure, the connecting wire has the disadvantages of long lead path and too small cross-sectional area, resulting in excessive heat generation and low mechanical strength of the structure

Moreover, because the electrodes on the wafer block part of the light-emitting area, the light output rate of the LED wafer is reduced, which affects the display brightness.

In addition, the current wire bonding process takes up a lot of module production time, resulting in a decrease in production efficiency and an increase in cost.

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