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Vapor deposition source, vapor deposition device, and method for manufacturing vapor deposition film

An evaporation source and evaporation technology, applied in lighting devices, vacuum evaporation coating, semiconductor/solid-state device manufacturing, etc., can solve the problems of blurred patterns, pixel defects, and the inability of evaporation particles to pass through the film-forming substrate, etc., to achieve Effect of suppressing shadows and improving uniformity

Inactive Publication Date: 2020-05-15
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the vapor deposition particles incident on the mask opening at a shallow angle from an oblique direction cannot pass through the mask opening and reach the substrate to be filmed.
Therefore, when the length of the long-side direction of the vapor-deposition source is extended, the distribution of vapor-deposition particles in the long-side direction of the vapor-deposition source deviates, and the film thickness of the shadowed part of the vapor-deposition mask becomes thinner, resulting in Many phenomena called shading, such as blurred patterns, or partial loss of pixels

Method used

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  • Vapor deposition source, vapor deposition device, and method for manufacturing vapor deposition film
  • Vapor deposition source, vapor deposition device, and method for manufacturing vapor deposition film
  • Vapor deposition source, vapor deposition device, and method for manufacturing vapor deposition film

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no. 1 approach

[0031] based on the following Figure 1 to Figure 5 One embodiment of the present invention will be described.

[0032] figure 1 It is a perspective view showing a partially enlarged schematic structure of the vapor deposition source 1 according to the present embodiment, together with the diffusion of the vapor deposition particles 11 emitted from the vapor deposition source 1 . figure 2 (a) is a cross-sectional view showing the schematic structure of the main part of the vapor deposition source 1 according to the present embodiment, an example of its size, and the film-forming substrate 200 together. figure 2 (b) is a cross-sectional view showing a schematic configuration of a main part of vapor deposition apparatus 100 including vapor deposition source 1 according to the present embodiment.

[0033] Hereinafter, the horizontal axis direction along the arrangement direction of the nozzles 3 in the vapor deposition source 1, that is, the direction perpendicular to the sca...

no. 2 approach

[0082] Mainly based on Figure 6 and Figure 7 This embodiment will be described. In this embodiment, differences from the first embodiment will be described, and components having the same functions as those used in the first embodiment will be given the same reference numerals, and descriptions thereof will be omitted.

[0083] Figure 6 It is a partially enlarged schematic configuration of the main part of the vapor deposition source 1 according to the present embodiment, and is a cross-sectional view showing the diffusion of the vapor deposition particles 11 emitted from the vapor deposition source 1 . In addition, in this embodiment, the housing part 2 and the plurality of nozzles 3 in the vapor deposition source 1 are positioned at the central position in the X-axis direction (position X 0 ) as the center and axisymmetrically arranged in the X-axis direction. Thus, in Figure 6 Only the position X in the storage part 2 is shown in the figure 0 The part between one ...

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Abstract

A vapor deposition source (1) is provided with an accommodating part (2) for accommodating vapor deposition particles (11), and a plurality of nozzles (3) arranged in a line along an X-axis direction,the plurality of nozzles at end parts in the X-axis direction of the accommodating part protruding in an oblique direction toward the end parts in the X-axis direction, the arrangement density of thenozzles in the end parts in the X-axis direction of the accommodating part being greater than the arrangement density of nozzles in a center part of the accommodating part, and a line (L2) connectingtop end surfaces (32) of adjacent nozzles in the end parts in the X-axis direction of the accommodating part being a straight line.

Description

technical field [0001] The present invention relates to a vapor deposition source called a line source or a linear source, a vapor deposition device including the vapor deposition source, and a method for producing a vapor deposition film using the vapor deposition particle injection device. Background technique [0002] In a flat panel display such as an EL (Electro luminescence) display device having a light-emitting element, a vacuum evaporation method is generally used to form functional layers such as a light-emitting layer provided between a pair of electrodes constituting the light-emitting element. [0003] In the manufacture of such a display device, in many cases, a large mother substrate having a large area substrate is used as a substrate to be filmed from the viewpoint of increasing the size of the display screen and suppressing manufacturing costs. In the case of forming a vapor-deposited film on such a large film-forming substrate, scanning vapor deposition is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24H01L51/50H05B33/10H10K99/00
CPCH05B33/10C23C14/24C23C14/12C23C16/45578H10K71/164H10K71/00H10K71/16C23C14/243H01L33/005H10K71/166
Inventor 西口昌男
Owner SHARP KK
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