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Clamping equipment and lateral coating equipment for nitrogen-oxygen sensor chips

A technology of nitrogen and oxygen sensors and clamping equipment, which is applied to devices, instruments, and coatings for coating liquid on the surface, and can solve problems such as difficult electrode extraction, complicated wiring, and inability to mass produce nitrogen and oxygen sensor chips.

Pending Publication Date: 2020-05-19
浙江百岸科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the complexity of the nitrogen and oxygen sensor circuit, it is difficult to lead out all the electrodes simply through the hole conduction, and a part of the circuit needs to run on the side of the nitrogen and oxygen sensor chip, and the traditional nitrogen and oxygen sensor equipment cannot effectively clamp multiple nitrogen and oxygen sensor chips. These NOx sensor chips are coated on the side, making mass production of NOx sensor chips impossible

Method used

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  • Clamping equipment and lateral coating equipment for nitrogen-oxygen sensor chips
  • Clamping equipment and lateral coating equipment for nitrogen-oxygen sensor chips
  • Clamping equipment and lateral coating equipment for nitrogen-oxygen sensor chips

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Embodiment Construction

[0027] The specific embodiments of the invention will be further described below in conjunction with the accompanying drawings.

[0028] see Figure 1 to Figure 12 , the application provides a clamping device (hereinafter referred to as the clamping device) for simultaneously clamping a plurality of nitrogen and oxygen sensor chips to side-coat the nitrogen and oxygen sensor chips, so that the nitrogen and oxygen sensor chips can be mass-produced and the production rate can be improved. efficiency.

[0029] See Figure 1 to Figure 8 , the clamping device 100 includes a plurality of first workpieces 110, a plurality of second workpieces 120 and a third workpiece (not shown in the figure). Wherein, the first workpiece 110 and the second workpiece 120 are staggered and the height of the second workpiece 120 is smaller than the height of the first workpiece 110 to form a clamping gap 130 between two adjacent first workpieces 110, and the third workpiece is used for The first wo...

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Abstract

The invention relates to clamping equipment and lateral coating equipment for nitrogen-oxygen sensor chips. The clamping equipment comprises a plurality of first workpieces, a plurality of second workpieces and a third workpiece, wherein the first workpieces and the second workpieces are arranged in a staggered manner; the height of each second workpiece is less than that of each first workpiece,and thus a clamping gap is formed between every two adjacent first workpieces; and the third workpiece is used for fixing the first workpieces and the second workpieces. By the adoption of the above clamping equipment and the lateral coating equipment for the nitrogen-oxygen sensor chips, nitrogen-oxygen sensors can be accommodated in the clamping gaps and then clamped; the quantities of the firstworkpieces and the second workpieces can be set according to the quantity of the nitrogen-oxygen sensors which need to be clamped simultaneously; and accordingly, the lateral coating process of the multiple nitrogen-oxygen sensors can be easy, the mass production of the nitrogen-oxygen sensor chips can be achieved, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of sensor equipment, in particular to clamping equipment for nitrogen and oxygen sensor chips and side coating equipment for nitrogen and oxygen sensor chips. Background technique [0002] In recent years, the application of nitrogen and oxygen sensors has become more and more extensive, so the professional production equipment of nitrogen and oxygen sensors has become more and more important. Due to the complexity of the nitrogen and oxygen sensor circuit, it is difficult to lead out all the electrodes simply through the hole conduction, and a part of the circuit needs to run on the side of the nitrogen and oxygen sensor chip, and the traditional nitrogen and oxygen sensor equipment cannot effectively clamp multiple nitrogen and oxygen sensor chips. These NOx sensor chips are coated on the side, making mass production of NOx sensor chips impossible. Contents of the invention [0003] Based on this, it is...

Claims

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Application Information

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IPC IPC(8): B05C1/02B05C13/02G01N33/00
CPCB05C1/027B05C13/02G01N33/0027
Inventor 蔡丰勇
Owner 浙江百岸科技有限公司