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Spectrum dimming packaging structure containing purple light or near ultraviolet chip and manufacturing method thereof

A packaging structure, near-ultraviolet technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of secondary absorption, spectral loss, low color rendering index of mixed phosphors, avoid reabsorption, and achieve high quantum efficiency. , Improve the effect of light efficiency

Pending Publication Date: 2020-05-19
HAIDIKE NANTONG OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the solar spectrum, the spectrogram obtained by the invention can be found to mainly have the following defects: compared with the ideal solar spectrum, the obtained spectrum has no ultraviolet spectrum segment, especially the violet band with a wavelength lower than 420nm is missing; the spectral wavelength is greater than Absence of long-wave spectrum above 750nm; absence of spectrum in 475nm band
However, using shorter-wavelength blue or violet light to excite mixed phosphors can improve the excitation efficiency of cyan phosphors, but it increases the photon energy consumption of short-wavelength photons when exciting yellow and long-wavelength phosphors.
[0011] Second, there is also the problem of secondary absorption for mixed phosphors
Compared with multi-wavelength excitation, the emission spectrum of single-wavelength excitation light is narrower, and the color rendering index is lower, which cannot meet the needs of wide-spectrum high color rendering index

Method used

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  • Spectrum dimming packaging structure containing purple light or near ultraviolet chip and manufacturing method thereof
  • Spectrum dimming packaging structure containing purple light or near ultraviolet chip and manufacturing method thereof
  • Spectrum dimming packaging structure containing purple light or near ultraviolet chip and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0110] Example for making 4000K color temperature spectrum dimming package structure:

[0111] The first wavelength blue-ray chip chooses 14*30mil specification, its peak wavelength λA is 465nm, the peak wavelength of the long-wavelength phosphor adhesive layer is 650nm, the powder-to-adhesive ratio of the long-wavelength phosphor adhesive layer is 1.7:1, and the long-wavelength phosphor adhesive layer is at The thickness of the top surface of the first-wavelength Blu-ray chip is 200 microns, and the thickness of the side is 0 microns, that is, there is no side;

[0112] The specification of the second wavelength blue light chip is 14*30mil, and the wavelength λB is 452nm;

[0113] The specification of the violet or near-ultraviolet chip is 14*30mil, the wavelength λC is 410nm, the peak wavelength of the short-wavelength phosphor adhesive layer is 480nm, the powder-to-adhesive ratio of the short-wavelength phosphor adhesive layer is 2:1, and the thickness of the short-waveleng...

Embodiment 2

[0117] Example for making 3000K color temperature spectrum dimming package structure:

[0118] The first wavelength blue-ray chip chooses 14*30mil specification, its peak wavelength λA is 465nm, the peak wavelength of the long-wavelength phosphor adhesive layer is 650nm, the powder-to-adhesive ratio of the long-wavelength phosphor adhesive layer is 4:1, and the long-wavelength phosphor adhesive layer is at The thickness of the top surface of the first wavelength blue light chip is 200 microns, and the thickness of the side is 120 microns;

[0119] The specification of the second wavelength blue light chip is 14*30mil, and the wavelength λB is 452nm;

[0120] The specification of the violet or near-ultraviolet chip is 14*30mil, the wavelength λC is 410nm, the peak wavelength of the short-wavelength phosphor adhesive layer is 480nm, the powder-to-adhesive ratio of the short-wavelength phosphor adhesive layer is 2:1, and the thickness of the short-wavelength phosphor adhesive lay...

Embodiment 3

[0124] For example, it is used to make 5000K color temperature spectrum dimming package structure, which is applied to chilled lamps:

[0125] The first wavelength blue-ray chip chooses 14*30mil specification, its peak wavelength λA is 465nm, the peak wavelength of the long-wavelength phosphor adhesive layer is 650nm, the powder-to-adhesive ratio of the long-wavelength phosphor adhesive layer is 0.2:1, and the long-wavelength phosphor adhesive layer is at The thickness of the top surface of the first wavelength blue light chip is 200 microns, and the thickness of the side is 0 microns;

[0126] The specification of the second wavelength blue light chip is 14*30mil, and the wavelength λB is 452nm;

[0127] The specification of the violet or near-ultraviolet chip is 14*30mil, the wavelength λC is 410nm, the peak wavelength of the short-wavelength phosphor adhesive layer is 480nm, the powder-to-adhesive ratio of the short-wavelength phosphor adhesive layer is 5:1, and the thickne...

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Abstract

The invention relates to a spectrum dimming packaging structure containing a purple light or near ultraviolet chip. The invention further relates to a manufacturing method of the packaging structure.The packaging structure comprises a first wavelength blue light chip, a second wavelength blue light chip, a purple light or near ultraviolet chip and a packaging layer, wherein a long-wavelength fluorescent powder adhesive layer is arranged on the surface of the first-wavelength blue-light chip to form a long-wavelength packaging body, a short-wavelength fluorescent powder adhesive layer is arranged on the surface of the purple-light or near-ultraviolet chip to form a short-wavelength packaging body, and the packaging layer is used for integrally packaging the short-wavelength packaging bodies, the second-wavelength blue-light chip and the long-wavelength packaging body. The spectrum dimming packaging structure has the advantages that the excitation wavelength of different fluorescent powder can be considered by adopting a plurality of chips with different wavelengths to excite, so that short-wavelength fluorescence generated by the short-wavelength fluorescent powder can be preventedfrom exciting long-wavelength fluorescent powder again and being absorbed again; the highest quantum efficiency is achieved through the optimal excitation wavelength, and meanwhile the lighting effect of the light source is improved.

Description

technical field [0001] The invention relates to a spectrum dimming packaging structure containing purple or near-ultraviolet chips, and also relates to a manufacturing method of the spectrum dimming packaging structure containing purple or near-ultraviolet chips. Background technique [0002] Human beings have lived on the earth for millions of years, and are constantly evolving with the changes of the living environment, but the only constant is the dependence and adaptation to sunlight. Therefore, it can be considered that natural light or sunlight is the most comfortable and healthy light source for human beings. Healthy lighting is an important trend in the development of lighting in the future, and LED solar full-spectrum light sources are the main way to achieve healthy lighting. [0003] The spectrum of sunlight includes ultraviolet, visible and infrared spectral bands, which can be called the full spectrum. Natural light full-spectrum LED light source means that th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/54
CPCH01L25/075H01L33/48H01L33/50H01L33/54Y02B20/00Y02P60/14
Inventor 孙智江王书昶吴陆吉爱华
Owner HAIDIKE NANTONG OPTOELECTRONICS TECH CO LTD
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