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Substrate and display device

A substrate and carrier technology, applied in the field of substrates and display equipment, can solve problems such as difficult alignment of micro light-emitting diodes, affecting transfer yield, substrate warping, etc.

Active Publication Date: 2020-05-22
PLAYNITRIDE DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the substrate on which the micro-LEDs are installed is heated and dissipated, because the thermal expansion coefficients of various materials are different, the substrate may be warped (bowing or warpage) due to thermal stress.
In practice, when the substrate is warped, it will also drive the displacement of the micro-LEDs on the substrate, making it difficult for the micro-LEDs to align with the components on another substrate, thereby affecting the transfer yield

Method used

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  • Substrate and display device
  • Substrate and display device
  • Substrate and display device

Examples

Experimental program
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Effect test

Embodiment Construction

[0041] In order to specifically describe the implementation and achieved effects of the present application, an example is provided and illustrated as follows.

[0042] Please also refer to figure 1 , figure 1 It is a schematic diagram showing the structure of a substrate corresponding to an upper concave carrier according to an embodiment of the present application. Such as figure 1As shown, the substrate 1 disclosed in this embodiment can be used to receive a plurality of micro-components 92 on the carrier 90. Here, the micro-component 92 can be, for example, a vertical or flip-chip micro-LED, and some embodiments can also be applied to other micro-components, including micro-integrated circuits, micro-laser diodes, and micro-sensing components. The carrier 90 can be, for example, a growth substrate or a temporary substrate of the micro-component 92, while the substrate 1 of this embodiment at this time can be a permanent substrate (display panel) of the micro-component 9...

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Abstract

The invention provides a substrate and a display device. The substrate is used for receiving a plurality of micro components in a carrier plate, and comprises a plate body, a first conductive convex block and a second conductive convex block. The plate body is provided with a first surface, a transfer area is defined on the first surface, and a center position and an edge position are defined in the transfer area. The first conductive bump is disposed at the center and has a first volume. The second conductive bump is arranged at the edge position and has a second volume. The first volume is different from the second volume.

Description

technical field [0001] The present application relates to a substrate and a display device, and more particularly to a substrate for receiving a plurality of microcomponents and a display device including the plurality of microcomponents. Background technique [0002] When manufacturing micro LED (micro LED) displays, it is necessary to form multiple micro LEDs on a substrate (such as a temporary substrate), and then transfer the micro LEDs to another substrate (such as a temporary substrate) in large quantities. or the corresponding location on the permanent substrate). However, when the substrate on which the micro-LEDs are installed is heated and dissipated, due to the difference in coefficient of thermal expansion among various materials, the substrate may be warped due to thermal stress. In practice, when the substrate is warped, it will also drive the displacement of the micro-LEDs on the substrate, making it difficult for the micro-LEDs to align with components on an...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L33/62H01L23/488
CPCH01L25/167H01L33/62H01L24/17H01L2224/81191H01L2224/81001H01L2924/3511
Inventor 陈培欣史诒君陈奕静
Owner PLAYNITRIDE DISPLAY CO LTD