Pressure welding device and pressure welding method
A technology of pressing head and pressing mechanism, which is applied in the direction of assembling printed circuits, printed circuits, and electrical components with electrical components, can solve problems such as damage to display panels and IC electrical components, and avoid potential safety hazards, stable heating rate, and heat. uniform effect
Active Publication Date: 2022-04-15
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0004] In view of the shortcomings of the existing methods, the present application proposes a pressure welding device and a pressure welding method to solve the technical problem in the prior art that the high temperature pressure head damages the display panel, IC, FPC and other electrical components
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[0028] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.
[0029] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...
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Embodiments of the present application provide a pressure welding device and a pressure welding method. The pressure welding device includes a pressing mechanism and an induction heating mechanism. The pressing mechanism is used for pressing the display panel, the electrical components, and the conductive adhesive film between the display panel and the electrical components; the induction heating mechanism cooperates with the conductive adhesive film for An alternating magnetic field is generated, which makes the conductive adhesive film self-heating and curing, and connects the display panel and the electrical components together. The alternating magnetic field is generated by the induction heating mechanism, so that the ferromagnetic material in the conductive adhesive film generates heat to complete the curing of the internal adhesive of the conductive adhesive film; compared with the existing technology, the heating rate is more stable through the self-heating of the conductive adhesive film , The display panel, IC, FPC and other electrical components are heated more evenly, avoiding the damage of the display panel, IC, FPC and other electrical components by the high-temperature pressure head. At the same time, due to the cancellation of the hardware heat source, the safety hazard caused by the high-temperature pressure head in the production process is avoided.
Description
technical field [0001] The invention relates to the technical field of display equipment processing, and in particular, the application relates to a pressure welding device and a pressure welding method. Background technique [0002] In the manufacturing process of display devices, most display panels need to connect electrical components such as driver chips (Integrated Circuit, referred to as IC) or flexible circuit boards (Flexible Printed Circuit, referred to as FPC) on their periphery. The connection and conduction of IC and FPC requires the use of conductive film, and the commonly used conductive film is Anisotropic Conductive Film (ACF for short). [0003] At present, under certain temperature and pressure conditions, the display panel is connected and conducted with electrical components such as IC and FPC through ACF. This pressure welding process is often called bonding (Bonding). In the existing process, high-temperature indenters are used to complete the pressur...
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IPC IPC(8): H05K3/30H05K3/36
CPCH05K3/305H05K3/365H05K2203/1105
Inventor 李明夏毓涵杨培梁承振邓皓丹李文刚郑伟唐敏
Owner BOE TECH GRP CO LTD