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Piezoelectric type vibration shock isolating buffer

An isolation buffer, piezoelectric technology, applied in shock absorbers, vibration suppression adjustment, non-rotation vibration suppression and other directions, can solve the problems of complex structure and large volume, and achieve the effect of enhanced attenuation

Inactive Publication Date: 2020-06-05
NAVAL UNIV OF ENG PLA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the limitation of the volume of sensors and actuators, for small equipment that requires micro-amplitude precision vibration reduction, this active vibration reduction device has a complex structure and a large volume, which cannot meet the stringent requirements of precision machining and manufacturing.

Method used

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  • Piezoelectric type vibration shock isolating buffer
  • Piezoelectric type vibration shock isolating buffer
  • Piezoelectric type vibration shock isolating buffer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The piezoelectric film adopts PZT-5H, and its parameters are k 33 =0.3, operational amplifier A 1 Using OPA445, close Ks, open Kp, C 0s = 1nF, R 0s = 1MΩ, R 2s = 10kΩ, R 1s It is an adjustable resistance of 100kΩ. At this time, the connection between the piezoelectric sheet and the circuit is a series structure, and the adjustment resistance R 1s =31.25kΩ; capacitance ratio δ s =-0.96, the relative center frequency η is 0.5625; adjust the resistance R 1s =50kΩ, capacitance ratio δ s =-0.6.

[0034] Based on the aforementioned structure, the relative vibration isolation frequency of the piezoelectric vibration shock isolation buffer of the present invention is 0.9386. It can be conveniently and quickly adjusted at 0.5ω by adjusting the resistance 0 —ω 0 Adjust the vibration isolation center frequency within the range of , where ω 0 It is the open-circuit natural frequency of the piezoelectric sheet. The vibration isolation efficiency of the piezoelectric vib...

Embodiment 2

[0036] The piezoelectric film adopts PZT-5A, and its parameters are k 33 = 0.2, operational amplifier A 2 Using OPA445, close Kp, open Ks, C 0p = 1nF, R 0p = 1MΩ, R 2p = 10kΩ, R 1p It is an adjustable resistance of 100kΩ. At this time, the connection between the piezoelectric sheet and the circuit is a parallel structure, and the adjustment resistance R 1p =25kΩ, capacitance ratio δ p =-1.2, the relative center frequency is 1.1471; adjust the resistance R 1p =20kΩ, capacitance ratio δ p =-1.5, the relative vibration isolation frequency is 1.066.

[0037] Based on the aforementioned structure, the piezoelectric vibration and shock isolation buffer of the present invention is convenient in ω 0 —1.5ω 0 Adjust the vibration isolation center frequency within the range of , where ω 0 It is the open circuit natural frequency of the piezoelectric sheet, and the vibration isolation efficiency can reach more than 60%, and the displacement accuracy can reach the micron level....

Embodiment 3

[0039] The piezoelectric film is made of polyvinylidene fluoride PVF2 piezoelectric film, and its parameters are k 31 =0.1, operational amplifier A 1 and A 2 Both adopt AD844, close Kp and Ks at the same time, C 0s =C 0p = 1nF, R 0s =R 0p = 1MΩ, R 2s =R 2p = 10kΩ, R 1s =R 1p 100kΩ adjustable resistor. The piezoelectric sheet has both series and parallel branch structures, adjusting the resistance R 1s =11kΩ, capacitance ratio δ s =-0.9091, at this time the relative center frequency is 0.9535; adjust the resistance R 1p =8kΩ, capacitance ratio δ p =-1.25, the relative center frequency is 1.0260.

[0040] Based on the foregoing structure, the piezoelectric vibration shock isolation buffer of the present invention can be conveniently adjusted at 0.5ω by adjusting the resistance 0 —1.5ω 0 Adjust the vibration isolation center frequency within the range of , where ω 0 It is the open-circuit natural frequency of the piezoelectric sheet, and the vibration isolation ...

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Abstract

The invention belongs to the technical field of precision vibration isolating buffering devices or structures, and particularly relates to a piezoelectric type vibration shock isolating buffer. The piezoelectric type vibration shock isolating buffer comprises a piezoelectric plate arranged between a vibration platform and an isolated object; one end of the piezoelectric plate is grounded, and theother end of the piezoelectric plate is connected with a first branch and a second branch through a switch Ks and a switch Kp; and the Kp is switched on, the Ks is switched off, the frequency of an isolating vibration signal of the piezoelectric type vibration shock isolating buffer moves towards low frequency, the gain of a low-frequency signal is increased, and the energy can be attenuated extremely fast. The Ks is switched on, the Kp is switched off, the frequency of the isolating vibration signal of the piezoelectric type vibration shock isolating buffer moves towards high frequency, the gain of a high-frequency signal is increased, and the energy is attenuated extremely fast. The Ks and Kp are switched on, a piezoelectric system will have two resonant frequencies. The piezoelectric type vibration shock isolating buffer is simple in structure and easy to microminiaturize, external micro-vibration and micro shocks can be isolated, and the buffering frequency and the vibration shockbuffering bandwidth are easy to adjust.

Description

technical field [0001] The invention belongs to the technical field of precision vibration isolation buffer devices or structures, and in particular relates to a piezoelectric type vibration shock isolation buffer. Background technique [0002] In precision manufacturing and micro-nano technology, in order to achieve extremely high dimensional accuracy, a device that is isolated from external micro-vibration and micro-shock is required. It needs to be compact and miniaturized. In order to isolate the vibration frequency of external changes or the impact of isolation, The isolation frequency of this buffer is required to be adjustable, and sometimes it is required to have a larger buffer bandwidth. Although there are many different types or structures of vibration isolation and shock absorbing devices on the market, including coil springs, air bags, etc. Systems using coil springs suffer from the inability to suppress low frequency vibrations. Although the damping system us...

Claims

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Application Information

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IPC IPC(8): F16F15/02
CPCF16F15/002F16F15/02F16F2224/0283
Inventor 张文群郭文勇袁成人
Owner NAVAL UNIV OF ENG PLA